Shang-Yun Hou

Person

Jubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,916,009
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,852,868
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,854,983
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,848,304
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,830,745
- Issue date Nov 28, 2023
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,810,793
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, integrated optical communication system
- Patent number 11,764,123
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,747,563
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Grant
Giga interposer integration through chip-on-wafer-on-substrate
- Patent number 11,728,254
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 11,705,407
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,699,674
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, integrated optical communication system
- Patent number 11,694,939
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer test structures and methods
- Patent number 11,682,593
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,630,271
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,592,618
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,569,172
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic device including the same, and man...
- Patent number 11,569,156
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,552,054
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package containing device dies and interconnect die and redistribut...
- Patent number 11,532,585
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 11,527,454
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,508,696
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,502,015
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 11,502,056
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,495,544
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor packages and methods of forming same
- Patent number 11,495,472
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,493,689
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,476,184
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,462,418
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240153861
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240103220
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240105627
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR FORMING THE SAME
- Publication number 20240099030
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096719
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20240063177
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
- Publication number 20240055468
- Publication date Feb 15, 2024
- TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Chips Comprising Inductor-Vias and Methods Forming th...
- Publication number 20240047509
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230393336
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Application
PACKAGES WITH MULTIPLE TYPES OF UNDERFILL AND METHOD FORMING THE SAME
- Publication number 20230395564
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20230387058
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230378132
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Transceiver and Manufacturing Method Thereof
- Publication number 20230350142
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20230307382
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages Including Interconnect Die Embedded in Package Substrates
- Publication number 20230307427
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20230307375
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230299033
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20230260896
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Chips
- Publication number 20230124804
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230085054
- Publication date Mar 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEIMING CHRIS CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Transceiver and Manufacturing Method Thereof
- Publication number 20230014813
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20220381985
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20220375806
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220367335
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- KUO-CHIANG TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20220367362
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20220365278
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220367208
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...
- Publication number 20220365274
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu HUANG
- G02 - OPTICS
Information Patent Application
Packages With Multiple Types of Underfill and Method Forming The Same
- Publication number 20220367413
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20220359460
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Shang-Yun Hou

Person

Patents Grantslast 30 patents

Encapsulated package including device dies connected via interconne...

Giga interposer integration through Chip-On-Wafer-On-Substrate

Semiconductor package and manufacturing method thereof

Photonic semiconductor device and method of manufacture

Semiconductor devices and methods of manufacture

Semiconductor device and method of forming the same

3D packages and methods for forming the same

Semiconductor packages and methods of forming same

Semiconductor package, integrated optical communication system

Photonic semiconductor device and method of manufacture

Giga interposer integration through chip-on-wafer-on-substrate

Package structure and fabricating method thereof

Semiconductor package and method of forming the same

Semiconductor package, integrated optical communication system

Interposer test structures and methods

Package structure

Photonic semiconductor device and method of manufacture

Semiconductor devices and methods of manufacture

Semiconductor device, electronic device including the same, and man...

Package structure and method of manufacturing the same

Package containing device dies and interconnect die and redistribut...

Package structures and methods of forming the same

Semiconductor device

Semiconductor package and manufacturing method thereof

Joint structure in semiconductor package and manufacturing method t...

Semiconductor devices and methods of manufacture

Semicondutor packages and methods of forming same

Photonic semiconductor device and method of manufacture

Semiconductor device and method for manufacturing the same

Integrated circuit package and method

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Semiconductor Devices and Methods of Manufacture

CHIP PACKAGE AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming the Same

PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME

Packages with Chips Comprising Inductor-Vias and Methods Forming th...

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PACKAGES WITH MULTIPLE TYPES OF UNDERFILL AND METHOD FORMING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Optical Transceiver and Manufacturing Method Thereof

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

Packages Including Interconnect Die Embedded in Package Substrates

Semiconductor Package and Method of Forming the Same

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD

Interconnect Chips

SEMICONDUCTOR DEVICE

Optical Transceiver and Manufacturing Method Thereof

Photonic Semiconductor Device and Method of Manufacture

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Devices and Methods of Manufacture

Photonic Semiconductor Device and Method of Manufacture

Semiconductor Packages and Methods of Forming Same

PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...

Packages With Multiple Types of Underfill and Method Forming The Same

Semiconductor Device and Method of Forming the Same