Shang-Yun Hou

Person

Jubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,259,578
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Grant
Optical transceiver and manufacturing method thereof
- Patent number 12,253,729
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,243,824
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,242,108
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 12,237,288
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 12,165,992
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic silicon spatial beam transformer integrated on 3DIC packag...
- Patent number 12,124,078
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- G02 - OPTICS
Information Patent Grant
Packages with multiple types of underfill and method forming the same
- Patent number 12,087,733
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,087,727
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,080,681
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,080,638
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 12,062,590
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,051,668
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic package and method of manufacture
- Patent number 12,038,599
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer structure with Chiplet Interposer
- Patent number 12,027,455
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 12,002,721
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet interposer
- Patent number 11,996,371
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 11,990,443
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,916,009
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,852,868
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,854,983
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,848,304
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,830,745
- Issue date Nov 28, 2023
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,810,793
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250093593
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Lin
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250062249
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...
- Publication number 20240418932
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu HUANG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240385377
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF
- Publication number 20240385398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240385395
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240387198
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387385
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...
- Publication number 20240387386
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240363483
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363518
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUO-CHIANG TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363587
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20240339432
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Package and Method of Manufacture
- Publication number 20240329302
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER
- Publication number 20240312898
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines and The Method Forming the Same Through Stitching
- Publication number 20240310733
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET INTERPOSER
- Publication number 20240266303
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...
- Publication number 20240258261
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20240222242
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240153861
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240103220
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240105627
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR FORMING THE SAME
- Publication number 20240099030
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096719
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20240063177
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
- Publication number 20240055468
- Publication date Feb 15, 2024
- TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Shang-Yun Hou

Person

Patents Grantslast 30 patents

Photonic semiconductor device and method of manufacture

Optical transceiver and manufacturing method thereof

Semiconductor devices and methods of manufacture

Photonic semiconductor device and method of manufacture

Semiconductor die package and method of manufacture

Package structure and fabricating method thereof

Semiconductor package and manufacturing method thereof

Forming large chips through stitching

Photonic silicon spatial beam transformer integrated on 3DIC packag...

Packages with multiple types of underfill and method forming the same

Joint structure in semiconductor package and manufacturing method t...

Package structure and method of fabricating the same

Semiconductor device and method for manufacturing the same

Method for manufacturing semiconductor package structure

Semiconductor package and method of forming the same

Photonic package and method of manufacture

Chip package structure

Chip-on-wafer structure with Chiplet Interposer

Integrated circuit package and method of forming same

Method of fabricating semiconductor structure

Chiplet interposer

Semiconductor die package and method of manufacture

Encapsulated package including device dies connected via interconne...

Giga interposer integration through Chip-On-Wafer-On-Substrate

Semiconductor package and manufacturing method thereof

Photonic semiconductor device and method of manufacture

Semiconductor devices and methods of manufacture

Semiconductor device and method of forming the same

3D packages and methods for forming the same

Semiconductor packages and methods of forming same

Patents Applicationslast 30 patents

OPTICAL DEVICE AND METHOD OF MANUFACTURE

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

FORMING LARGE CHIPS THROUGH STITCHING

PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...

SEMICONDUCTOR PACKAGE

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF

OPTICAL DEVICE AND METHOD OF MANUFACTURE

Integrated Circuit Package and Method

Semiconductor Devices and Methods of Manufacture

INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING PACKAGE STRUCTURE

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

Photonic Package and Method of Manufacture

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER

Redistribution Lines and The Method Forming the Same Through Stitching

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

CHIPLET INTERPOSER

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Semiconductor Devices and Methods of Manufacture

CHIP PACKAGE AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming the Same

PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME