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Shanghsuan CHIANG
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Shenzhen, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Encapsulation of a substrate electrically connected to a plurality...
Patent number
11,276,645
Issue date
Mar 15, 2022
Huawei Technologies Co., Ltd.
Nan Zhao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC...
Publication number
20240178187
Publication date
May 30, 2024
HUAWEI TECHNOLOGIES CO., LTD.
Shanghsuan CHIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND CHIP PACKAGING METHOD
Publication number
20230037617
Publication date
Feb 9, 2023
Huawei Technologies Co., Ltd
Jiantao ZHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE, ELECTRONIC DEVICE, AND CHIP PACKAGE PREPARATION METHOD
Publication number
20220278056
Publication date
Sep 1, 2022
Huawei Technologies Co., Ltd
Nan ZHAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED CHIP AND METHOD FOR MANUFACTURING PACKAGED CHIP
Publication number
20220020659
Publication date
Jan 20, 2022
Huawei Technologies Co., Ltd
Jiantao ZHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP AND PACKAGING METHOD
Publication number
20200381361
Publication date
Dec 3, 2020
Huawei Technologies Co., Ltd
Nan ZHAO
H01 - BASIC ELECTRIC ELEMENTS