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Shankar S. Pennathur
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-layer thin-film coatings for system-in-package assemblies in...
Patent number
11,266,010
Issue date
Mar 1, 2022
Apple Inc.
Yanfeng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package including opposing circuit boards
Patent number
10,966,321
Issue date
Mar 30, 2021
Apple Inc.
Yanfeng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package including opposing circuit boards
Patent number
10,709,018
Issue date
Jul 7, 2020
Apple Inc.
Yanfeng Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System-in-package including opposing circuit boards
Patent number
10,356,903
Issue date
Jul 16, 2019
Apple Inc.
Yanfeng Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System-in-package devices with magnetic shielding
Patent number
10,147,685
Issue date
Dec 4, 2018
Apple Inc.
Phillip R. Sommer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer thin-film coatings for system-in-package assemblies in...
Patent number
9,949,359
Issue date
Apr 17, 2018
Apple Inc.
Yanfeng Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Shielding structures for system-in-package assemblies in portable e...
Patent number
9,913,412
Issue date
Mar 6, 2018
Apple Inc.
Yanfeng Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Low-area overhead connectivity solutions to SIP module
Patent number
9,839,133
Issue date
Dec 5, 2017
Apple Inc.
Meng Chi Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal solutions for system-in-package assemblies in portable elec...
Patent number
9,820,373
Issue date
Nov 14, 2017
Apple Inc.
Shankar S. Pennathur
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Printed circuits with sacrificial test structures
Patent number
9,618,564
Issue date
Apr 11, 2017
Apple Inc.
Sean A. Mayo
G01 - MEASURING TESTING
Information
Patent Grant
Simultaneous independently controlled dual side PCB molding technique
Patent number
9,484,228
Issue date
Nov 1, 2016
Apple Inc.
Scott L. Gooch
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Methods for transparent encapsulation and selective encapsulation
Patent number
9,485,870
Issue date
Nov 1, 2016
Apple Inc.
Sean A. Mayo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING
Publication number
20240074066
Publication date
Feb 29, 2024
Apple Inc.
Nitesh KUMBHAT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
Publication number
20200375033
Publication date
Nov 26, 2020
Apple Inc.
Yanfeng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
Publication number
20200154561
Publication date
May 14, 2020
Apple Inc.
Yanfeng CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
Publication number
20190306979
Publication date
Oct 3, 2019
Apple Inc.
Yanfeng Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
Publication number
20180220525
Publication date
Aug 2, 2018
Apple Inc.
Yanfeng CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
System-in-Package Devices With Magnetic Shielding
Publication number
20170263569
Publication date
Sep 14, 2017
Apple Inc.
Phillip R. Sommer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIMULTANEOUS INDEPENDENTLY CONTROLLED DUAL SIDE PCB MOLDING TECHNIQUE
Publication number
20160099159
Publication date
Apr 7, 2016
Apple Inc.
Scott L. Gooch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-AREA OVERHEAD CONNECTIVITY SOLUTIONS TO SIP MODULE
Publication number
20160021756
Publication date
Jan 21, 2016
Apple Inc.
Meng Chi Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMAL SOLUTIONS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE ELEC...
Publication number
20150382448
Publication date
Dec 31, 2015
Apple Inc.
Shankar S. PENNATHUR
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LOW AREA OVER-HEAD CONNECTIVITY SOLUTIONS TO SIP MODULE
Publication number
20150359099
Publication date
Dec 10, 2015
Apple Inc.
Shankar Pennathur
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
Publication number
20150271911
Publication date
Sep 24, 2015
Apple Inc.
Yanfeng CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SHIELDING STRUCTURES FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE E...
Publication number
20150271959
Publication date
Sep 24, 2015
Apple Inc.
Yanfeng CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS FOR TRANSPARENT ENCAPSULATION AND SELECTIVE ENCAPSULATION
Publication number
20140190930
Publication date
Jul 10, 2014
Apple Inc.
Sean A. Mayo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SINGULATED IC STIFFENER AND DE-BOND PROCESS
Publication number
20140038357
Publication date
Feb 6, 2014
Apple Inc.
Shawn X. ARNOLD
H01 - BASIC ELECTRIC ELEMENTS