Shankarram Athreya

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Processes for making a barrier between a dielectric and a conductor...
- Patent number 6,677,254
- Issue date Jan 13, 2004
- Applied Materials, Inc.
- Pravin Narwankar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps on a semiconductor wafer
- Patent number 6,426,282
- Issue date Jul 30, 2002
- Applied Materials, Inc.
- Dinesh Saigal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Processes for making a barrier between a dielectric and a conductor...
- Publication number 20030025146
- Publication date Feb 6, 2003
- Pravin Narwankar
- H01 - BASIC ELECTRIC ELEMENTS