Shannon D. Buzard

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for applying a final metal layer for wafer level packaging a...
- Patent number 8,980,743
- Issue date Mar 17, 2015
- FlipChip International LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING A...
- Publication number 20150270223
- Publication date Sep 24, 2015
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING A...
- Publication number 20130328203
- Publication date Dec 12, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS