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Shanshan Xu
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Boulder, CO, US
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Patents Grants
last 30 patents
Information
Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
Patent number
12,188,732
Issue date
Jan 7, 2025
The Regents of the University of Colorado
Ronggui Yang
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
Patent number
11,898,807
Issue date
Feb 13, 2024
The Regents of the University of Colorado, a Body Corporate
Ronggui Yang
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Micropillar-enabled thermal ground plane
Patent number
11,598,594
Issue date
Mar 7, 2023
The Regents of the University of Colorado
Ryan John Lewis
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
Patent number
11,306,983
Issue date
Apr 19, 2022
The Regents of the University of Colorado, a Body Corporate
Ronggui Yang
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Micropillar-enabled thermal ground plane
Patent number
10,731,925
Issue date
Aug 4, 2020
The Regents of the University of Colorado, a Body Corporate
Ryan John Lewis
F28 - HEAT EXCHANGE IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT
Publication number
20240133643
Publication date
Apr 25, 2024
The Regents of the University of Colorado, a Body Corporate
Ronggui Yang
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
MICROPILLAR-ENABLED THERMAL GROUND PLANE
Publication number
20230332841
Publication date
Oct 19, 2023
KELVIN THERMAL TECHNOLOGIES, INC.
Ryan John Lewis
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT
Publication number
20220221233
Publication date
Jul 14, 2022
The Regents of the University of Colorado, a Body Corporate
Ronggui Yang
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT
Publication number
20210131753
Publication date
May 6, 2021
The Regents of the University of Colorado, a Body Corporate
Ronggui Yang
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
MICROPILLAR-ENABLED THERMAL GROUND PLANE
Publication number
20200300563
Publication date
Sep 24, 2020
KELVIN THERMAL TECHNOLOGIES, INC.
Ryan John Lewis
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
MICROPILLAR-ENABLED THERMAL GROUND PLANE
Publication number
20160076820
Publication date
Mar 17, 2016
The Regents of the University of Colorado, a Body Corporate
Ryan John Lewis
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
VACUUM-ENHANCED HEAT SPREADER
Publication number
20160081227
Publication date
Mar 17, 2016
The Regents of the University of Colorado, a Body Corporate
Yung-Cheng Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR