Shantinath Ghongadi

Person

Tilgard, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for in-situ measurement of sheet resistance on...
- Patent number 12,105,039
- Issue date Oct 1, 2024
- Lam Research Corporation
- Manish Ranjan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,859,300
- Issue date Jan 2, 2024
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 11,512,408
- Issue date Nov 29, 2022
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,401,623
- Issue date Aug 2, 2022
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 11,225,727
- Issue date Jan 18, 2022
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 11,208,732
- Issue date Dec 28, 2021
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting wave front control for reduced air entrapment during wafer...
- Patent number 10,968,531
- Issue date Apr 6, 2021
- Novellus Systems, Inc.
- Manish Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 10,927,475
- Issue date Feb 23, 2021
- Lam Research Corporation
- Zhian He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configuration and method of operation of an electrodeposition syste...
- Patent number 10,745,817
- Issue date Aug 18, 2020
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 10,689,774
- Issue date Jun 23, 2020
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for estimating on-wafer oxide layer reducti...
- Patent number 10,497,592
- Issue date Dec 3, 2019
- Lam Research Corporation
- Manish Ranjan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 10,443,146
- Issue date Oct 15, 2019
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gap fill process stability monitoring of an electroplating process...
- Patent number 10,358,738
- Issue date Jul 23, 2019
- Lam Research Corporation
- Quan Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Front referenced anode
- Patent number 10,351,968
- Issue date Jul 16, 2019
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 10,214,828
- Issue date Feb 26, 2019
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 10,214,829
- Issue date Feb 26, 2019
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating cup with contoured cup bottom
- Patent number 10,053,792
- Issue date Aug 21, 2018
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 10,011,917
- Issue date Jul 3, 2018
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 9,988,734
- Issue date Jun 5, 2018
- Lam Research Corporation
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Configuration and method of operation of an electrodeposition syste...
- Patent number 9,816,193
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating semiconductor wafer when co...
- Patent number 9,816,196
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of electrolyte flow dynamics for uniform electroplating
- Patent number 9,816,194
- Issue date Nov 14, 2017
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for estimating on-wafer oxide layer reducti...
- Patent number 9,735,035
- Issue date Aug 15, 2017
- Lam Research Corporation
- Manish Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for edge bevel removal of copper from silicon...
- Patent number 9,685,353
- Issue date Jun 20, 2017
- Novellus Systems, Inc.
- Kousik Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Membrane design for reducing defects in electroplating systems
- Patent number 9,677,190
- Issue date Jun 13, 2017
- Lam Research Corporation
- Doyeon Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting wave front control for reduced air entrapment during wafer...
- Patent number 9,587,322
- Issue date Mar 7, 2017
- Novellus Systems, Inc.
- Manish Ranjan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating cup with contoured cup bottom
- Patent number 9,512,538
- Issue date Dec 6, 2016
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Front referenced anode
- Patent number 9,340,893
- Issue date May 17, 2016
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting wave front control for reduced air entrapment during wafer...
- Patent number 9,028,666
- Issue date May 12, 2015
- Novellus Systems, Inc.
- Manish Ranjan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Front referenced anode
- Patent number 9,028,657
- Issue date May 12, 2015
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED ATMOSPHERIC PLASMA TREATMENT STATION IN PROCESSING TOOL
- Publication number 20240213089
- Publication date Jun 27, 2024
- LAM RESEARCH CORPORATION
- Navaneetha Krishnan SUBBAIYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20240141540
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND TECHNIQUES FOR OPTICAL MEASUREMENT OF THIN FILMS
- Publication number 20240055282
- Publication date Feb 15, 2024
- LAM RESEARCH CORPORATION
- Liu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...
- Publication number 20230313408
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Liu YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS TO IMPROVE WAFER WETTABILITY FOR PLATING - ENHANCEMENT THRO...
- Publication number 20230260837
- Publication date Aug 17, 2023
- LAM RESEARCH CORPORATION
- Hyungjun Hur
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...
- Publication number 20230076493
- Publication date Mar 9, 2023
- Novellus Systems, Inc.
- Jingbin FENG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
IN-SITU MONITORING OF SUBSTRATE SURFACES
- Publication number 20220349850
- Publication date Nov 3, 2022
- LAM RESEARCH CORPORATION
- Manish Ranjan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-SITU SENSOR-FUSION WITH ARTIFICIAL INTELLIGENCE
- Publication number 20220342387
- Publication date Oct 27, 2022
- Lam Reaearch Corporation
- Yu Ding
- G05 - CONTROLLING REGULATING
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20220333267
- Publication date Oct 20, 2022
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEM INCLUDING OPTICAL PROBES
- Publication number 20220228287
- Publication date Jul 21, 2022
- LAM RESEARCH CORPORATION
- Andrew James PFAU
- G01 - MEASURING TESTING
Information Patent Application
IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS
- Publication number 20210366768
- Publication date Nov 25, 2021
- LAM RESEARCH CORPORATION
- Zhian HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20210130976
- Publication date May 6, 2021
- LAM RESEARCH CORPORATION
- Zhian He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20200277708
- Publication date Sep 3, 2020
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20190390361
- Publication date Dec 26, 2019
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20190145018
- Publication date May 16, 2019
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20190127872
- Publication date May 2, 2019
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...
- Publication number 20180347065
- Publication date Dec 6, 2018
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20180282894
- Publication date Oct 4, 2018
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20180266005
- Publication date Sep 20, 2018
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20180266006
- Publication date Sep 20, 2018
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GAP FILL PROCESS STABILITY MONITORING OF AN ELECTROPLATING PROCESS...
- Publication number 20180080140
- Publication date Mar 22, 2018
- LAM RESEARCH CORPORATION
- Quan Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...
- Publication number 20180038007
- Publication date Feb 8, 2018
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20180030611
- Publication date Feb 1, 2018
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20170362734
- Publication date Dec 21, 2017
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUSES FOR ESTIMATING ON-WAFER OXIDE LAYER REDUCTI...
- Publication number 20170309505
- Publication date Oct 26, 2017
- LAM RESEARCH CORPORATION
- Manish Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR ESTIMATING ON-WAFER OXIDE LAYER REDUCTI...
- Publication number 20170221740
- Publication date Aug 3, 2017
- LAM RESEARCH CORPORATION
- Manish Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER...
- Publication number 20170137958
- Publication date May 18, 2017
- Novellus Systems, Inc.
- Manish Ranjan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING
- Publication number 20160273119
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20160273124
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FRONT REFERENCED ANODE
- Publication number 20160222541
- Publication date Aug 4, 2016
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Shantinath Ghongadi

Person

Patents Grantslast 30 patents

Systems and methods for in-situ measurement of sheet resistance on...

Controlling plating electrolyte concentration on an electrochemical...

Lipseals and contact elements for semiconductor electroplating appa...

Controlling plating electrolyte concentration on an electrochemical...

Control of current density in an electroplating apparatus

Monitoring surface oxide on seed layers during electroplating

Wetting wave front control for reduced air entrapment during wafer...

Controlling plating electrolyte concentration on an electrochemical...

Configuration and method of operation of an electrodeposition syste...

Control of current density in an electroplating apparatus

Methods and apparatuses for estimating on-wafer oxide layer reducti...

Monitoring surface oxide on seed layers during electroplating

Gap fill process stability monitoring of an electroplating process...

Front referenced anode

Control of current density in an electroplating apparatus

Control of current density in an electroplating apparatus

Plating cup with contoured cup bottom

Control of current density in an electroplating apparatus

Lipseals and contact elements for semiconductor electroplating appa...

Configuration and method of operation of an electrodeposition syste...

Method and apparatus for electroplating semiconductor wafer when co...

Control of electrolyte flow dynamics for uniform electroplating

Methods and apparatuses for estimating on-wafer oxide layer reducti...

Apparatus and method for edge bevel removal of copper from silicon...

Membrane design for reducing defects in electroplating systems

Wetting wave front control for reduced air entrapment during wafer...

Plating cup with contoured cup bottom

Front referenced anode

Wetting wave front control for reduced air entrapment during wafer...

Front referenced anode

Patents Applicationslast 30 patents

INTEGRATED ATMOSPHERIC PLASMA TREATMENT STATION IN PROCESSING TOOL

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

SYSTEMS AND TECHNIQUES FOR OPTICAL MEASUREMENT OF THIN FILMS

PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...

METHODS TO IMPROVE WAFER WETTABILITY FOR PLATING - ENHANCEMENT THRO...

LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...

IN-SITU MONITORING OF SUBSTRATE SURFACES

IN-SITU SENSOR-FUSION WITH ARTIFICIAL INTELLIGENCE

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

ELECTROCHEMICAL DEPOSITION SYSTEM INCLUDING OPTICAL PROBES

IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

GAP FILL PROCESS STABILITY MONITORING OF AN ELECTROPLATING PROCESS...

CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

METHODS AND APPARATUSES FOR ESTIMATING ON-WAFER OXIDE LAYER REDUCTI...

METHODS AND APPARATUSES FOR ESTIMATING ON-WAFER OXIDE LAYER REDUCTI...

WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER...

CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

FRONT REFERENCED ANODE