Shao-An CHEN

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Molding for large panel fan-out package
- Patent number 10,453,764
- Issue date Oct 22, 2019
- Advanced Semiconductor Engineering, Inc.
- Shao-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having a protection layer
- Patent number 10,211,161
- Issue date Feb 19, 2019
- Advanced Semiconductor Engineering, Inc.
- Yuan-Feng Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180061767
- Publication date Mar 1, 2018
- Advanced Semiconductor Engineering, Inc.
- Yuan-Feng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING FOR LARGE PANEL FAN-OUT PACKAGE
- Publication number 20180047651
- Publication date Feb 15, 2018
- Advanced Semiconductor Engineering, Inc.
- Shao-An CHEN
- H01 - BASIC ELECTRIC ELEMENTS