Shao Hsuan CHUANG

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Recessed portion in a substrate and method of forming the same
- Patent number 11,886,015
- Issue date Jan 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,848,143
- Issue date Dec 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Yunghsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,495,557
- Issue date Nov 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,410,957
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 11,411,073
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure, package structure, and method for manufacturing...
- Patent number 11,398,442
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Wan Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed portion in a substrate and method of forming the same
- Patent number 11,262,506
- Issue date Mar 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices having conductive layer, semiconducto...
- Patent number 11,107,881
- Issue date Aug 31, 2021
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20240168238
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230027674
- Publication date Jan 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20220236489
- Publication date Jul 28, 2022
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR MANUFACTURING...
- Publication number 20220139854
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Wan Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220108826
- Publication date Apr 7, 2022
- Advanced Semiconductor Engineering, Inc.
- Yunghsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20220043215
- Publication date Feb 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan CHUANG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220028817
- Publication date Jan 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210296267
- Publication date Sep 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210265459
- Publication date Aug 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20200343336
- Publication date Oct 29, 2020
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS

Shao Hsuan CHUANG

Person

Patents Grantslast 30 patents

Recessed portion in a substrate and method of forming the same

Electronic device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor package structure and method of manufacturing the same

Semiconductor package device and method for manufacturing the same

Bonding structure, package structure, and method for manufacturing...

Recessed portion in a substrate and method of forming the same

Semiconductor package devices having conductive layer, semiconducto...

Patents Applicationslast 30 patents

RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME

BONDING STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR MANUFACTURING...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICES AND METHODS OF MAKING THE SAME