Shao-Kang Hung

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Pingtung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package device with a heat dissipation structure and...
- Patent number 8,288,863
- Issue date Oct 16, 2012
- Global Unichip Corporation
- Chia-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package device with a heat dissipation structure and...
- Publication number 20120104581
- Publication date May 3, 2012
- Global Unichip Corporation
- Chia-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS