Shao-Yuan Lee

Person

Jinsha Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure
- Patent number 12,002,750
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier and air-gap scheme for high performance interconnects
- Patent number 12,002,749
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer overlying dielectric structure to increase reliability
- Patent number 11,990,400
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,935,783
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
- Patent number 11,923,243
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising cap layer over dielectric layer and...
- Patent number 11,908,792
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect strucutre with protective etch-stop
- Patent number 11,901,221
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping layer and methods thereof
- Patent number 11,894,266
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structure and methods of forming the...
- Patent number 11,854,963
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 11,810,815
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including low-resistance interconnect and i...
- Patent number 11,769,695
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via structure by selective deposition
- Patent number 11,756,878
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interconnect structure for thermal management of electrical...
- Patent number 11,658,092
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dispersion layers for double sided interconnect
- Patent number 11,640,928
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,557,511
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 11,538,749
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping layer and methods thereof
- Patent number 11,527,435
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,450,566
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interconnect structures including air gaps
- Patent number 11,361,989
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect strucutre with protective etch-stop
- Patent number 11,355,390
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer overlying dielectric structure to increase reliability
- Patent number 11,355,430
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,335,596
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 11,322,395
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 11,227,833
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 11,222,843
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising etch stop layer over dielectric lay...
- Patent number 11,189,560
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping layer and methods thereof
- Patent number 11,075,113
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a self-assembly layer to facilitate selective formation of an...
- Patent number 11,069,526
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating a low-resistance interconnect
- Patent number 10,930,551
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for fabrication semiconductor device
- Patent number 10,867,843
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240194589
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20240162084
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICLE GEARSHIFT AUTOMATIC CONTROL DEVICE AND METHOD THEREOF
- Publication number 20240151304
- Publication date May 9, 2024
- Industrial Technology Research Institute
- Shao-Yu Lee
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
- Publication number 20240136221
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...
- Publication number 20240088023
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL SELF-ALIGN VIA STRUCTURE BY SELECTIVE DEPOSITION
- Publication number 20240021517
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...
- Publication number 20230386901
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC CAPPING STRUCTURE OVERLYING A CONDUCTIVE STRUCTURE TO IN...
- Publication number 20230377954
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Resistance Interconnect
- Publication number 20230369114
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION
- Publication number 20230290705
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT
- Publication number 20230260867
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...
- Publication number 20230260831
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...
- Publication number 20230253286
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230154789
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Capping Layer and Methods Thereof
- Publication number 20230112282
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...
- Publication number 20230061501
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...
- Publication number 20230065583
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230066861
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC-ON-DIELECTRIC STRUCTURE A...
- Publication number 20230064448
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230067027
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT
- Publication number 20230066284
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20230063438
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20230068760
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230067886
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS
- Publication number 20230068892
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING A...
- Publication number 20230016154
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20220406648
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20220359385
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...
- Publication number 20220319990
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES INCLUDING AIR GAPS
- Publication number 20220310442
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS

Shao-Yuan Lee

Person

Patents Grantslast 30 patents

Interconnect structure

Barrier and air-gap scheme for high performance interconnects

Capping layer overlying dielectric structure to increase reliability

Selective deposition for integrated circuit interconnect structures

Semiconductor structure having air gaps and method for manufacturin...

Semiconductor device comprising cap layer over dielectric layer and...

Interconnect strucutre with protective etch-stop

Metal capping layer and methods thereof

Semiconductor interconnection structure and methods of forming the...

Dielectric capping structure overlying a conductive structure to in...

Semiconductor structure including low-resistance interconnect and i...

Self-aligned via structure by selective deposition

Thermal interconnect structure for thermal management of electrical...

Heat dispersion layers for double sided interconnect

Semiconductor device structure and methods of forming the same

Interconnect structure

Metal capping layer and methods thereof

Semiconductor device and manufacturing method thereof

Method for manufacturing interconnect structures including air gaps

Interconnect strucutre with protective etch-stop

Capping layer overlying dielectric structure to increase reliability

Selective deposition for integrated circuit interconnect structures

Dielectric capping structure overlying a conductive structure to in...

Interconnect structure and method for forming the same

Interconnect structure and method for forming the same

Semiconductor device comprising etch stop layer over dielectric lay...

Metal capping layer and methods thereof

Using a self-assembly layer to facilitate selective formation of an...

Methods for fabricating a low-resistance interconnect

Method and system for fabrication semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

VEHICLE GEARSHIFT AUTOMATIC CONTROL DEVICE AND METHOD THEREOF

INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP

SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...

NOVEL SELF-ALIGN VIA STRUCTURE BY SELECTIVE DEPOSITION

SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...

DIELECTRIC CAPPING STRUCTURE OVERLYING A CONDUCTIVE STRUCTURE TO IN...

Low-Resistance Interconnect

SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION

HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT

SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...

THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Metal Capping Layer and Methods Thereof

SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...

SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC-ON-DIELECTRIC STRUCTURE A...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS

SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING A...

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...

INTERCONNECT STRUCTURE

SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...

INTERCONNECT STRUCTURES INCLUDING AIR GAPS