Shaofeng DING

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,199,016
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including same
- Patent number 12,107,034
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method of manufacturing the interposer
- Patent number 12,014,935
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,961,882
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor
- Patent number 11,955,509
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jihyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,876,038
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and stack of semiconductor chips
- Patent number 11,871,553
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,798,883
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,791,267
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including interposer substrates further inclu...
- Patent number 11,728,311
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure, semiconductor package comprising the same, an...
- Patent number 11,538,747
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and stacked semiconductor chips including thro...
- Patent number 11,437,374
- Issue date Sep 6, 2022
- SAMSUNG ELECTRONICS CO., LTD.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a capacitor structure and a thin fil...
- Patent number 11,139,286
- Issue date Oct 5, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,133,266
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,114,524
- Issue date Sep 7, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having capacitor
- Patent number 11,094,624
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,043,456
- Issue date Jun 22, 2021
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,892,318
- Issue date Jan 12, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having buffer structure surrounding through via
- Patent number 10,867,908
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, method of manufacturing interposer, and method of manuf...
- Patent number 10,535,575
- Issue date Jan 14, 2020
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure and method of manufacturing structure including the...
- Patent number 9,831,139
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250014968
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006594
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20240395672
- Publication date Nov 28, 2024
- Name SAMSUNG ELECTRONICS CO.,LTD.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234490
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR
- Publication number 20240222421
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Jihyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE
- Publication number 20240178131
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Sunoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
- Publication number 20240164081
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105556
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230260893
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- JIHYUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230170289
- Publication date Jun 1, 2023
- Samsung Electronics Co., Ltd.
- Woo Seong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND A METHOD OF FABR...
- Publication number 20230154894
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Jegwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...
- Publication number 20230131382
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR
- Publication number 20220384563
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- JIHYUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20220336326
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- SHAOFENG DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220328404
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220278024
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220278193
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
- Publication number 20220271045
- Publication date Aug 25, 2022
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20220028827
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20210296229
- Publication date Sep 23, 2021
- Samsung Electronics Co., Ltd.
- Jinho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR CHIPS
- Publication number 20210242203
- Publication date Aug 5, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210125937
- Publication date Apr 29, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD OF MANUFACTURING THE INTERPOSER
- Publication number 20210118696
- Publication date Apr 22, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AN...
- Publication number 20210118794
- Publication date Apr 22, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20200350248
- Publication date Nov 5, 2020
- Samsung Electronics Co., Ltd.
- Jinho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR
- Publication number 20200343178
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR STRUCTURE AND A THIN FIL...
- Publication number 20200235087
- Publication date Jul 23, 2020
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200135843
- Publication date Apr 30, 2020
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200075712
- Publication date Mar 5, 2020
- SAMSUNG ELECTRONICS CO., LTD.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20200006199
- Publication date Jan 2, 2020
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS

Shaofeng DING

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor chip and semiconductor package including same

Interposer and method of manufacturing the interposer

Semiconductor device

Metal-insulator-metal capacitor

Semiconductor device

Semiconductor device and stack of semiconductor chips

Semiconductor device and method of fabricating the same

Semiconductor devices

Semiconductor devices including interposer substrates further inclu...

Interposer structure, semiconductor package comprising the same, an...

Semiconductor device and stacked semiconductor chips including thro...

Semiconductor device including a capacitor structure and a thin fil...

Semiconductor device and method of fabricating the same

Semiconductor device

Semiconductor device having capacitor

Semiconductor devices

Semiconductor device and method for fabricating the same

Semiconductor device having buffer structure surrounding through via

Interposer, method of manufacturing interposer, and method of manuf...

Test structure and method of manufacturing structure including the...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME

SEMICONDUCTOR DEVICE

METAL-INSULATOR-METAL CAPACITOR

SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE

SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND A METHOD OF FABR...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...

METAL-INSULATOR-METAL CAPACITOR

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

INTERPOSER AND METHOD OF MANUFACTURING THE INTERPOSER

INTERPOSER STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AN...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE HAVING CAPACITOR

SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR STRUCTURE AND A THIN FIL...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME