TREA

Shaopeng Sun

Follow

Person

  • Orange, CT, US
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Cobalt filling of interconnects in microelectronics
    • Patent number 11,434,578
    • Issue date Sep 6, 2022
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cobalt filling of interconnects
    • Patent number 11,401,618
    • Issue date Aug 2, 2022
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cobalt chemistry for smooth topology
    • Patent number 11,230,778
    • Issue date Jan 25, 2022
    • MacDermid Enthone Inc.
    • Shaopeng Sun
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cobalt filling of interconnects
    • Patent number 11,035,048
    • Issue date Jun 15, 2021
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cobalt filling of interconnects in microelectronics
    • Patent number 10,995,417
    • Issue date May 4, 2021
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    COBALT CHEMISTRY FOR SMOOTH TOPOLOGY
    • Publication number 20220136123
    • Publication date May 5, 2022
    • MacDermid Enthone Inc.
    • Shaopeng Sun
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Composition and Method for Fabrication of Nickel Interconnects
    • Publication number 20220064811
    • Publication date Mar 3, 2022
    • MacDermid Enthone Inc.
    • Eric Yakobson
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Cobalt Filling of Interconnects
    • Publication number 20210332491
    • Publication date Oct 28, 2021
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Cobalt Filling of Interconnects in Microelectronics
    • Publication number 20210222314
    • Publication date Jul 22, 2021
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    COBALT CHEMISTRY FOR SMOOTH TOPOLOGY
    • Publication number 20210180200
    • Publication date Jun 17, 2021
    • MacDermid Enthone Inc.
    • Shaopeng Sun
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Cobalt Filling of Interconnects in Microelectronics
    • Publication number 20200040478
    • Publication date Feb 6, 2020
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Cobalt Filling of Interconnects
    • Publication number 20190010624
    • Publication date Jan 10, 2019
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR