Shaoyin Chen

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing with reduced warpage and/or controlled strain
- Patent number 9,401,277
- Issue date Jul 26, 2016
- Ultratech, Inc.
- Yun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for laser thermal processing of semiconductor dev...
- Patent number 7,612,372
- Issue date Nov 3, 2009
- Ultratech, Inc.
- Yun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for laser thermal processing of semiconductor dev...
- Patent number 6,844,250
- Issue date Jan 18, 2005
- Ultratech, Inc.
- Yun Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING WITH REDUCED WARPAGE AND/OR CONTROLLED STRAIN
- Publication number 20130273751
- Publication date Oct 17, 2013
- Yun Wang
- C30 - CRYSTAL GROWTH
Information Patent Application
SUBSTRATE PROCESSING WITH REDUCED WARPAGE AND/OR CONTROLLED STRAIN
- Publication number 20120071007
- Publication date Mar 22, 2012
- Ultratech, Inc.
- Yun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate processing with reduced warpage and/or controlled strain
- Publication number 20110028003
- Publication date Feb 3, 2011
- Ultratech, Inc.
- Yun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate processing with reduced warpage and/or controlled strain
- Publication number 20090278287
- Publication date Nov 12, 2009
- Yun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR