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Sharad M. Shah
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Multiple size package socket
Patent number
7,955,892
Issue date
Jun 7, 2011
GLOBALFOUNDRIES Inc.
Sharad M. Shah
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dual interposer packaging for high density interconnect
Patent number
6,812,485
Issue date
Nov 2, 2004
Hewlett-Packard Development Company, L.P.
Sharad M. Shah
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus for suppressing packaged semiconductor chip curvature whi...
Patent number
6,803,653
Issue date
Oct 12, 2004
Advanced Micro Devices, Inc.
Robert E. Likins
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Multiple Size Package Socket
Publication number
20090134511
Publication date
May 28, 2009
Sharad M. Shah
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Dual interposer packaging for high density interconnect
Publication number
20030123231
Publication date
Jul 3, 2003
Sharad M. Shah
G01 - MEASURING TESTING