Shariff Dzafir

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer adaptor for adapting different sized wafers
- Patent number 12,165,921
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Enrique Sarile
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 11,710,661
- Issue date Jul 25, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Enrique Jr Sarile
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages without debris
- Patent number 11,670,549
- Issue date Jun 6, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with electromagnetic interference shielding
- Patent number 10,714,431
- Issue date Jul 14, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive pillar having...
- Patent number 9,824,923
- Issue date Nov 21, 2017
- STATS ChipPAC Pte. Ltd.
- Dzafir Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with transparent encapsulation...
- Patent number 8,399,306
- Issue date Mar 19, 2013
- Stats Chippac Ltd.
- JunMo Koo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SURFACE PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230377896
- Publication date Nov 23, 2023
- UTAC Headquarters Pte. Ltd.
- Jackson Fernandez Rosario
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
- Publication number 20230343668
- Publication date Oct 26, 2023
- UTAC Headquarters Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230274979
- Publication date Aug 31, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230178413
- Publication date Jun 8, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd SHARIFF
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRAME MASK FOR SINGULATING WAFERS BY PLASMA ETCHING
- Publication number 20230154795
- Publication date May 18, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230154796
- Publication date May 18, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ADAPTORS, INCLUDING SYSTEMS AND METHODS, FOR ADAPTING DIFFERE...
- Publication number 20220336283
- Publication date Oct 20, 2022
- UTAC Headquarters Pte. Ltd.
- Enrique Jr Sarile
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ADAPTOR FOR ADAPTING DIFFERENT SIZED WAFERS
- Publication number 20220331917
- Publication date Oct 20, 2022
- UTAC Headquarters Pte. Ltd.
- Enrique Sarile
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES WITHOUT DEBRIS
- Publication number 20210193522
- Publication date Jun 24, 2021
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd SHARIFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20210118738
- Publication date Apr 22, 2021
- UTAC Headquarters Pte. Ltd.
- Enrique Jr SARILE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20190051614
- Publication date Feb 14, 2019
- UTAC Headquarters Pte. Ltd.
- Antonio Bambalan DIMAANO JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Pillar Having...
- Publication number 20130093100
- Publication date Apr 18, 2013
- STATS ChipPAC, Ltd.
- Dzafir Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSPARENT ENCAPSULATION...
- Publication number 20120241927
- Publication date Sep 27, 2012
- JunMo Koo
- H01 - BASIC ELECTRIC ELEMENTS

Shariff Dzafir

Person

Patents Grantslast 30 patents

Wafer adaptor for adapting different sized wafers

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages without debris

Semiconductor packages with electromagnetic interference shielding

Semiconductor device and method of forming conductive pillar having...

Integrated circuit packaging system with transparent encapsulation...

Patents Applicationslast 30 patents

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

BACK SURFACE PLASMA DICED WAFERS AND METHODS THEREOF

Semiconductor Packages and Methods of Forming RDL and Side and Back...

PLASMA DICED WAFERS AND METHODS THEREOF

PLASMA DICED WAFERS AND METHODS THEREOF

FRAME MASK FOR SINGULATING WAFERS BY PLASMA ETCHING

PLASMA DICED WAFERS AND METHODS THEREOF

WAFER ADAPTORS, INCLUDING SYSTEMS AND METHODS, FOR ADAPTING DIFFERE...

WAFER ADAPTOR FOR ADAPTING DIFFERENT SIZED WAFERS

SEMICONDUCTOR PACKAGES WITHOUT DEBRIS

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

Semiconductor Device and Method of Forming Conductive Pillar Having...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSPARENT ENCAPSULATION...