Sharon Mei Wan Ko

Follow

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Universal clamping mechanism
- Patent number 6,698,088
- Issue date Mar 2, 2004
- National Semiconductor Corporation
- Ah Lek Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking lead tips and die attach pad for a leadless package apparat...
- Patent number 6,686,652
- Issue date Feb 3, 2004
- National Semiconductor
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling for singulation of composite materials in molded semiconduc...
- Patent number 6,467,278
- Issue date Oct 22, 2002
- National Semiconductor Corporation
- Ah Lek Hu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Low inductance leadless package
- Patent number 6,452,255
- Issue date Sep 17, 2002
- National Semiconductor, Corp.
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical isolation in panels of leadless IC packages
- Patent number 6,399,415
- Issue date Jun 4, 2002
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Universal clamping mechanism
- Publication number 20040143962
- Publication date Jul 29, 2004
- National Semiconductor Corporation
- Ah Lek Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal clamping mechanism
- Publication number 20020100163
- Publication date Aug 1, 2002
- National Semiconductor Corporation
- Ah Lek Hu
- H01 - BASIC ELECTRIC ELEMENTS