Sharon N. Farrens

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of selectively transferring LED die to a backplane using hei...
- Patent number 10,714,464
- Issue date Jul 14, 2020
- GLO AB
- Anusha Pokhriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through backplane laser irradiation for die transfer
- Patent number 10,693,051
- Issue date Jun 23, 2020
- GLO AB
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an array of a multi-device unit cell
- Patent number 10,553,571
- Issue date Feb 4, 2020
- GLO AB
- Anusha Pokhriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective die repair on a light emitting device assembly
- Patent number 10,236,447
- Issue date Mar 19, 2019
- GLO AB
- Fariba Danesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through backplane laser irradiation for die transfer
- Patent number 10,193,038
- Issue date Jan 29, 2019
- GLO AB
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode array on a backplane and method of making thereof
- Patent number 10,177,123
- Issue date Jan 8, 2019
- GLO AB
- Nathan Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including carrier wafers and attached devi...
- Patent number 10,128,142
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an array of a multi-device unit cell
- Patent number 9,893,041
- Issue date Feb 13, 2018
- GLO AB
- Anusha Pokhriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for temporarily bonding a device wafer to a carrier wafer,...
- Patent number 9,716,023
- Issue date Jul 25, 2017
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including carrier wafers and methods of us...
- Patent number 9,472,518
- Issue date Oct 18, 2016
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH BACKPLANE LASER IRRADIATION FOR DIE TRANSFER
- Publication number 20190157533
- Publication date May 23, 2019
- GLO AB
- Sharon N. FARRENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN ARRAY OF A MULTI-DEVICE UNIT CELL
- Publication number 20180130779
- Publication date May 10, 2018
- GLO AB
- Anusha POKHRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE ARRAY ON A BACKPLANE AND METHOD OF MAKING THEREOF
- Publication number 20170373046
- Publication date Dec 28, 2017
- Nathan GARDNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DIE REPAIR ON A LIGHT EMITTING DEVICE ASSEMBLY
- Publication number 20170346011
- Publication date Nov 30, 2017
- GLO AB
- Fariba DANESH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN ARRAY OF A MULTI-DEVICE UNIT CELL
- Publication number 20170301660
- Publication date Oct 19, 2017
- GLO AB
- Anusha POKHRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH BACKPLANE LASER IRRADIATION FOR DIE TRANSFER
- Publication number 20170288102
- Publication date Oct 5, 2017
- GLO AB
- Sharon N. FARRENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVELY TRANSFERRING LED DIE TO A BACKPLANE USING HEI...
- Publication number 20170236811
- Publication date Aug 17, 2017
- GLO AB
- Anusha POKHRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...
- Publication number 20170011948
- Publication date Jan 12, 2017
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR TEMPORARILY BONDING A DEVICE WAFER TO A CARRIER WAFER,...
- Publication number 20160020129
- Publication date Jan 21, 2016
- Micron Technology, Inc.
- Sharon N. Farrens
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...
- Publication number 20150287687
- Publication date Oct 8, 2015
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS

Sharon N. Farrens

Person

Patents Grantslast 30 patents

Method of selectively transferring LED die to a backplane using hei...

Through backplane laser irradiation for die transfer

Method of forming an array of a multi-device unit cell

Selective die repair on a light emitting device assembly

Through backplane laser irradiation for die transfer

Light emitting diode array on a backplane and method of making thereof

Semiconductor structures including carrier wafers and attached devi...

Method of forming an array of a multi-device unit cell

Methods for temporarily bonding a device wafer to a carrier wafer,...

Semiconductor structures including carrier wafers and methods of us...

Patents Applicationslast 30 patents

THROUGH BACKPLANE LASER IRRADIATION FOR DIE TRANSFER

METHOD OF FORMING AN ARRAY OF A MULTI-DEVICE UNIT CELL

LIGHT EMITTING DIODE ARRAY ON A BACKPLANE AND METHOD OF MAKING THEREOF

SELECTIVE DIE REPAIR ON A LIGHT EMITTING DEVICE ASSEMBLY

METHOD OF FORMING AN ARRAY OF A MULTI-DEVICE UNIT CELL

THROUGH BACKPLANE LASER IRRADIATION FOR DIE TRANSFER

METHOD OF SELECTIVELY TRANSFERRING LED DIE TO A BACKPLANE USING HEI...

SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...

METHODS FOR TEMPORARILY BONDING A DEVICE WAFER TO A CARRIER WAFER,...

SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...