Shatil Haque

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Mohegan Lake, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Folded-flex bondwire-less multichip power package
- Patent number 6,731,000
- Issue date May 4, 2004
- Koninklijke Philips Electronics N.V.
- Shatil Haque
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FOLDED-FLEX BONDWIRE-LESS MULTICHIP POWER PACKAGE
- Publication number 20040089933
- Publication date May 13, 2004
- Koninklijke Philips Electronics N.V.
- Shatil Haque
- H01 - BASIC ELECTRIC ELEMENTS