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Shau-Fei Cheng
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Pingtung County, TW
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Patents Grants
last 30 patents
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Patent Grant
Redistribution structure and forming method thereof
Patent number
11,646,259
Issue date
May 9, 2023
Industrial Technology Research Institute
Shu-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip bonding apparatus, chip bonding method and a chip package stru...
Patent number
10,366,965
Issue date
Jul 30, 2019
Industrial Technology Research Institute
Shu-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
REDISTRIBUTION STRUCTURE AND FORMING METHOD THEREOF
Publication number
20220130744
Publication date
Apr 28, 2022
Industrial Technology Research Institute
Shu-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...
Publication number
20190131271
Publication date
May 2, 2019
Industrial Technology Research Institute
Shu-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20180294202
Publication date
Oct 11, 2018
Industrial Technology Research Institute
Wei-Yuan Cheng
H01 - BASIC ELECTRIC ELEMENTS