Shau-Lin Shue

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,132,000
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-assisted low-resistance interconnect structures and method...
- Patent number 12,113,021
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,094,848
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having deep metal line and method for formi...
- Patent number 12,094,816
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having dielectric-on-dielectric structure a...
- Patent number 12,094,815
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,074,060
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dispersion layers for double sided interconnect
- Patent number 12,074,084
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 12,068,254
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with interconnect structure having a...
- Patent number 12,068,193
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structure and methods of forming the...
- Patent number 12,068,248
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metallization layer with low capacitanc...
- Patent number 12,062,572
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,051,683
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,033,889
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,009,301
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a self-assembly layer to facilitate selective formation of an...
- Patent number 12,009,202
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,002,750
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier and air-gap scheme for high performance interconnects
- Patent number 12,002,749
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer overlying dielectric structure to increase reliability
- Patent number 11,990,400
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having air gap and method for formin...
- Patent number 11,972,975
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of barrier layer
- Patent number 11,948,834
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,935,783
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming graphene barrier layer in interconnect structure
- Patent number 11,929,326
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
- Patent number 11,923,306
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
- Patent number 11,923,243
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising cap layer over dielectric layer and...
- Patent number 11,908,792
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of conductor nanowires
- Patent number 11,908,789
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20240355803
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING A...
- Publication number 20240347381
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT
- Publication number 20240347412
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using A Self-Assembly Layer To Facilitate Selective Formation of An...
- Publication number 20240321573
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312835
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS
- Publication number 20240304541
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240290712
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240290718
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP
- Publication number 20240282623
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...
- Publication number 20240274528
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING LAYER OVERLYING DIELECTRIC STRUCTURE TO INCREASE RELIABILITY
- Publication number 20240274524
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deposition of Barrier Layer
- Publication number 20240266211
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES
- Publication number 20240258166
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE BARRIER LAYER
- Publication number 20240213157
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION TO A PARTIALLY FILLED TRENCH
- Publication number 20240213034
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240194589
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...
- Publication number 20240178002
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20240170403
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20240162084
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Formation of Conductor Nanowires
- Publication number 20240153870
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20240145381
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
- Publication number 20240136221
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20240085803
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240088042
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20240087990
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...
- Publication number 20240088023
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL SELF-ALIGN VIA STRUCTURE BY SELECTIVE DEPOSITION
- Publication number 20240021517
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SELF-FORMED BARRIER METAL LAYER
- Publication number 20240006233
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Kang FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMI...
- Publication number 20230387239
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE
- Publication number 20230387018
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS

Shau-Lin Shue

Person

Patents Grantslast 30 patents

Semiconductor device structure and methods of forming the same

Graphene-assisted low-resistance interconnect structures and method...

Semiconductor packages and methods for forming the same

Semiconductor structure having deep metal line and method for formi...

Interconnect structure and methods of forming the same

Semiconductor structure having dielectric-on-dielectric structure a...

Barrier-less structures

Semiconductor device structure and methods of forming the same

Heat dispersion layers for double sided interconnect

Interconnection structure and methods of forming the same

Semiconductor device structure with interconnect structure having a...

Semiconductor interconnection structure and methods of forming the...

Semiconductor device having metallization layer with low capacitanc...

Semiconductor packages and methods for forming the same

Semiconductor device structure and methods of forming the same

Interconnect structure

Using a self-assembly layer to facilitate selective formation of an...

Interconnect structure

Barrier and air-gap scheme for high performance interconnects

Capping layer overlying dielectric structure to increase reliability

Semiconductor device structure having air gap and method for formin...

Methods of forming interconnect structures in semiconductor fabrica...

Selective deposition of barrier layer

Selective deposition for integrated circuit interconnect structures

Method of forming graphene barrier layer in interconnect structure

Via connection to a partially filled trench

Semiconductor structure having air gaps and method for manufacturin...

Semiconductor structure having air gaps and method for manufacturin...

Semiconductor device comprising cap layer over dielectric layer and...

Selective formation of conductor nanowires

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING A...

HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT

Using A Self-Assembly Layer To Facilitate Selective Formation of An...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP

METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...

CAPPING LAYER OVERLYING DIELECTRIC STRUCTURE TO INCREASE RELIABILITY

Selective Deposition of Barrier Layer

SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES

GRAPHENE BARRIER LAYER

VIA CONNECTION TO A PARTIALLY FILLED TRENCH

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

Selective Formation of Conductor Nanowires

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...

INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...

NOVEL SELF-ALIGN VIA STRUCTURE BY SELECTIVE DEPOSITION

SEMICONDUCTOR DEVICE INCLUDING A SELF-FORMED BARRIER METAL LAYER

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMI...

GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE