Shaw Fong WONG

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Butterworth, MY

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Patents Grantslast 30 patents

Information Patent Grant
Contactless wafer separator
- Patent number 11,664,257
- Issue date May 30, 2023
- Intel Corporation
- Varshalaxmi Bhatt Dhruvkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lower IC package structure for coupling with an upper IC package to...
- Patent number 10,879,219
- Issue date Dec 29, 2020
- Intel Corporation
- Shaw Fong Wong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACTLESS WAFER SEPARATOR
- Publication number 20220005718
- Publication date Jan 6, 2022
- Intel Corporation
- Varshalaxmi Bhatt DHRUVKUMAR
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
COMPOSITE STACKED INTERCONNECTS FOR HIGH-SPEED APPLICATIONS AND MET...
- Publication number 20190311978
- Publication date Oct 10, 2019
- Intel Corporation
- Bok Eng Cheah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOWER IC PACKAGE STRUCTURE FOR COUPLING WITH AN UPPER IC PACKAGE TO...
- Publication number 20180374833
- Publication date Dec 27, 2018
- Intel Corporation
- Shaw Fong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lower IC Package Structure for Coupling with an Upper IC Package to...
- Publication number 20120159118
- Publication date Jun 21, 2012
- Shaw Fong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR REINFORCEMENT FOR CIRCUIT BOARDS
- Publication number 20090016036
- Publication date Jan 15, 2009
- Shaw Fong WONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR