Shawn M. O'Connor

Person

McKinney, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packages with high angle wire bonding and non-...
- Patent number 11,848,297
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device for use with multiple integrated circu...
- Patent number 6,916,682
- Issue date Jul 12, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method of formation
- Patent number 6,858,932
- Issue date Feb 22, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor with multiple rows of bond pads and method t...
- Patent number 6,476,506
- Issue date Nov 5, 2002
- Motorola, Inc.
- Shawn M. O'Connor
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...
- Publication number 20230005874
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partial Solder Mask Defined Pad Design
- Publication number 20080093749
- Publication date Apr 24, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Mark Allen Gerber
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stacked Chips with Underpinning
- Publication number 20070287227
- Publication date Dec 13, 2007
- Wyatt Allen Huddleston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for providing a BGA connection having improved...
- Publication number 20060131744
- Publication date Jun 22, 2006
- Shawn Martin O'Connor
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Packaged semiconductor device and method of formation
- Publication number 20030148554
- Publication date Aug 7, 2003
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE FOR USE WITH MULTIPLE INTEGRATED CIRCU...
- Publication number 20030085463
- Publication date May 8, 2003
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of formation
- Publication number 20020175400
- Publication date Nov 28, 2002
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS

Shawn M. O'Connor

Person

Patents Grantslast 30 patents

Semiconductor device packages with high angle wire bonding and non-...

Semiconductor package device for use with multiple integrated circu...

Packaged semiconductor device and method of formation

Packaged semiconductor with multiple rows of bond pads and method t...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...

Partial Solder Mask Defined Pad Design

Stacked Chips with Underpinning

Method and apparatus for providing a BGA connection having improved...

Packaged semiconductor device and method of formation

SEMICONDUCTOR PACKAGE DEVICE FOR USE WITH MULTIPLE INTEGRATED CIRCU...

Semiconductor device and method of formation