Sheau Hooi Lim

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Pulau Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Stress-relief layers and stress-compensation collars with low-tempe...
- Patent number 7,291,548
- Issue date Nov 6, 2007
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-relief layers and stress-compensation collars with low-tempe...
- Patent number 7,253,088
- Issue date Aug 7, 2007
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-relief layer and stress-compensation collar in contact array...
- Patent number 7,244,634
- Issue date Jul 17, 2007
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packaging compositions, packages and systems made therewith, a...
- Patent number 7,088,010
- Issue date Aug 8, 2006
- Intel Corporation
- Sheau Hooi Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRESS-RELIEF LAYERS AND STRESS-COMPENSATION COLLARS WITH LOW-TEMPE...
- Publication number 20070190772
- Publication date Aug 16, 2007
- Intel Corporation
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stress-relief layers and stress-compensation collars with low-tempe...
- Publication number 20060068579
- Publication date Mar 30, 2006
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Jet-dispensed stress relief layer in contact arrays, and processes...
- Publication number 20050224951
- Publication date Oct 13, 2005
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stress-relief layer and stress-compensation collar in contact array...
- Publication number 20050221534
- Publication date Oct 6, 2005
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chip packaging compositions, packages and systems made therewith, a...
- Publication number 20050133938
- Publication date Jun 23, 2005
- Intel Corporation
- Sheau Hooi Lim
- H01 - BASIC ELECTRIC ELEMENTS