Shei Meng LOO

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Patents Applicationslast 30 patents

Information Patent Application
MULTI-AXIS LASER DRILLING FOR WAFER-LEVEL PACKAGING
- Publication number 20240429095
- Publication date Dec 26, 2024
- STMicroelectronics International N.V.
- Shei Meng LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MULTI-DIE QFP-QFN PACKAGE
- Publication number 20240297147
- Publication date Sep 5, 2024
- STMicroelectronics International N.V.
- Shei Meng LOO
- H01 - BASIC ELECTRIC ELEMENTS