Sheila Chopin

Person

Round Rock, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Conduit inserts for encapsulant compound formulation kneading and e...
- Patent number 11,787,097
- Issue date Oct 17, 2023
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device attached to an exposed pad
- Patent number 10,217,713
- Issue date Feb 26, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and method for forming
- Patent number 10,199,339
- Issue date Feb 5, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a lead frame and method for forming
- Patent number 9,640,466
- Issue date May 2, 2017
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for lead frame package degating
- Patent number 9,426,884
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure with sacrificial anode and passivation laye...
- Patent number 9,412,709
- Issue date Aug 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,111,952
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 9,093,383
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Mold compound compatibility test system and methods thereof
- Patent number 8,955,388
- Issue date Feb 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- G01 - MEASURING TESTING
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 8,853,867
- Issue date Oct 7, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for use within a packaged semiconductor device
- Patent number 8,836,110
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 8,643,197
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
Information Patent Grant
Warpage control using a package carrier assembly
- Patent number 7,803,662
- Issue date Sep 28, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable metal finish for integrated circuit package leads and me...
- Patent number 7,215,014
- Issue date May 8, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Peng Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control of array packaging
- Patent number 7,172,927
- Issue date Feb 6, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having wire bonds and method therefor
- Patent number 7,015,585
- Issue date Mar 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive device including bond wires
- Patent number 6,998,952
- Issue date Feb 14, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND E...
- Publication number 20230415397
- Publication date Dec 28, 2023
- NXP USA, Inc.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND E...
- Publication number 20220250301
- Publication date Aug 11, 2022
- NXP USA, Inc.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD
- Publication number 20170098618
- Publication date Apr 6, 2017
- NXP USA, Inc.
- Sheila F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure With Sacrificial Anode and Method for Forming
- Publication number 20160329288
- Publication date Nov 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- SHEILA F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD
- Publication number 20160071787
- Publication date Mar 10, 2016
- SHEILA F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR LEAD FRAME PACKAGE DEGATING
- Publication number 20150027767
- Publication date Jan 29, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING
- Publication number 20140346663
- Publication date Nov 27, 2014
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140273352
- Publication date Sep 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT FOR A SEMICONDUCTOR DEVICE
- Publication number 20140145339
- Publication date May 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR USE WITHIN A PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20140061894
- Publication date Mar 6, 2014
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD COMPOUND COMPATIBILITY TEST SYSTEM AND METHODS THEREOF
- Publication number 20130319129
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- G01 - MEASURING TESTING
Information Patent Application
MRAM DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20120193737
- Publication date Aug 2, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Xingshou Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL USING A PACKAGE CARRIER ASSEMBLY
- Publication number 20090081831
- Publication date Mar 26, 2009
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged integrated circuit having a heat spreader and method therefor
- Publication number 20070031996
- Publication date Feb 8, 2007
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderable metal finish for integrated circuit package leads and me...
- Publication number 20060022313
- Publication date Feb 2, 2006
- Peng Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage control of array packaging
- Publication number 20050136567
- Publication date Jun 23, 2005
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive device including bond wires
- Publication number 20050122198
- Publication date Jun 9, 2005
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged integrated circuit having wire bonds and method therefor
- Publication number 20040119168
- Publication date Jun 24, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS

Sheila Chopin

Person

Patents Grantslast 30 patents

Conduit inserts for encapsulant compound formulation kneading and e...

Semiconductor device attached to an exposed pad

Semiconductor structure with sacrificial anode and method for forming

Packaged semiconductor device with a lead frame and method for forming

System and method for lead frame package degating

Semiconductor structure with sacrificial anode and passivation laye...

Semiconductor device

Encapsulant for a semiconductor device

Mold compound compatibility test system and methods thereof

Encapsulant for a semiconductor device

Heat spreader for use within a packaged semiconductor device

Encapsulant for a semiconductor device

Warpage control using a package carrier assembly

Solderable metal finish for integrated circuit package leads and me...

Warpage control of array packaging

Packaged integrated circuit having wire bonds and method therefor

Inductive device including bond wires

Patents Applicationslast 30 patents

CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND E...

CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND E...

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

Semiconductor Structure With Sacrificial Anode and Method for Forming

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

SYSTEM AND METHOD FOR LEAD FRAME PACKAGE DEGATING

SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING

SEMICONDUCTOR DEVICE

ENCAPSULANT FOR A SEMICONDUCTOR DEVICE

HEAT SPREADER FOR USE WITHIN A PACKAGED SEMICONDUCTOR DEVICE

MOLD COMPOUND COMPATIBILITY TEST SYSTEM AND METHODS THEREOF

MRAM DEVICE AND METHOD OF ASSEMBLING SAME

WARPAGE CONTROL USING A PACKAGE CARRIER ASSEMBLY

Packaged integrated circuit having a heat spreader and method therefor

Solderable metal finish for integrated circuit package leads and me...

Warpage control of array packaging

Inductive device including bond wires

Packaged integrated circuit having wire bonds and method therefor