Sheila Rima C. Magno

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with multi-surface die attach pad
- Patent number 8,536,689
- Issue date Sep 17, 2013
- Stats Chippac Ltd.
- Antonio B. Dimaano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONTROLLED SOLDER BUMP WETTING
- Publication number 20070090537
- Publication date Apr 26, 2007
- STATS ChipPAC Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONTROLLED SOLDER BUMP WETTING AND FABRI...
- Publication number 20060246629
- Publication date Nov 2, 2006
- STATS ChipPAC Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire sweep resistant semiconductor package and manufacturing method...
- Publication number 20060043612
- Publication date Mar 2, 2006
- STATS ChipPAC Ltd.
- Sheila Rima C. Magno
- H01 - BASIC ELECTRIC ELEMENTS