Shelby Ferguson

Person

Lacey, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for detaching a microprocessor from a heat sink
- Patent number 11,296,009
- Issue date Apr 5, 2022
- Intel Corporation
- Rolf Laido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, socket, and spacer to alter socket profile
- Patent number 10,455,685
- Issue date Oct 22, 2019
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with temperature sensor traces
- Patent number 10,260,961
- Issue date Apr 16, 2019
- Intel Corporation
- Shelby Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage mitigation in printed circuit board assemblies
- Patent number 10,178,763
- Issue date Jan 8, 2019
- Intel Corporation
- Rashelle Yee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package alignment frame for local reflow
- Patent number 9,991,223
- Issue date Jun 5, 2018
- Intel Corporation
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...
- Publication number 20240357744
- Publication date Oct 24, 2024
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEPARATOR DEVICES FOR HARDWARE COMPONENT SEPARATION
- Publication number 20230019643
- Publication date Jan 19, 2023
- Intel Corporation
- Daniel Neumann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK
- Publication number 20190304871
- Publication date Oct 3, 2019
- Intel Corporation
- Rolf Laido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...
- Publication number 20190306985
- Publication date Oct 3, 2019
- Shelby A. Ferguson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE-FEATURED TRACES FOR INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
- Publication number 20180174940
- Publication date Jun 21, 2018
- Intel Corporation
- Shelby Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH TEMPERATURE SENSOR TRACES
- Publication number 20170176260
- Publication date Jun 22, 2017
- Intel Corporation
- Shelby Ferguson
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW
- Publication number 20170179067
- Publication date Jun 22, 2017
- Intel Corporation
- RUSSELL S. AOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WARPAGE MITIGATION IN PRINTED CIRCUIT BOARD ASSEMBLIES
- Publication number 20170181271
- Publication date Jun 22, 2017
- Intel Corporation
- Rashelle Yee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
- Publication number 20170178994
- Publication date Jun 22, 2017
- Intel Corporation
- Michael Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Shelby Ferguson

Person

Patents Grantslast 30 patents

Method and apparatus for detaching a microprocessor from a heat sink

Server microprocessor carrier with guiding alignment anti-tilt and...

Electronic device, socket, and spacer to alter socket profile

Integrated circuit packages with temperature sensor traces

Warpage mitigation in printed circuit board assemblies

Semiconductor package alignment frame for local reflow

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...

BACKSIDE INTEGRATED TORSION LOADING MECHANISM

INTEGRATED SEPARATOR DEVICES FOR HARDWARE COMPONENT SEPARATION

METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK

SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...

FINE-FEATURED TRACES FOR INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES

INTEGRATED CIRCUIT PACKAGES WITH TEMPERATURE SENSOR TRACES

SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW

WARPAGE MITIGATION IN PRINTED CIRCUIT BOARD ASSEMBLIES

INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING