Sheldon A Bernard

Follow

Person

Corvallis, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Device including interposer between semiconductor and substrate
- Patent number 9,686,864
- Issue date Jun 20, 2017
- Hewlett-Packard Development Company, L.P.
- Robert G Walmsley
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
DEVICE INCLUDING INTERPOSER BETWEEN SEMICONDUCTOR AND SUBSTRATE
- Publication number 20150208507
- Publication date Jul 23, 2015
- Robert G Walmsley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR