Shen Bo Lin

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method and communication device of beacon reception
- Patent number 10,341,949
- Issue date Jul 2, 2019
- Mediatek Inc.
- Kuo-Chiang Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System and method for generating ions in an ion source
- Patent number 9,922,800
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package and mold of manufacturing the same
- Patent number 8,551,794
- Issue date Oct 8, 2013
- Advanced Optoelectronic Technology, Inc.
- Shen-Bo Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package with bounding dam surrounding LED chip and thermoset en...
- Patent number 8,492,790
- Issue date Jul 23, 2013
- Advanced Optoelectronic Technology, Inc.
- Shen-Bo Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package and manufacturing method thereof
- Patent number 8,436,392
- Issue date May 7, 2013
- Advanced Optoelectronic Technology, Inc.
- Chao-Hsiung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package and method of fabricating the same
- Patent number 8,378,378
- Issue date Feb 19, 2013
- Advanced Optoelectronic Technology, Inc.
- Shen Bo Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of compound semiconductor device and fabricating...
- Patent number 8,298,861
- Issue date Oct 30, 2012
- Advanced Optoelectronic Technology, Inc.
- Pin Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing LED package and substrate thereof
- Patent number 8,143,080
- Issue date Mar 27, 2012
- Advanced Optoelectronic Technology, Inc.
- Shen-Bo Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forwarding packets
- Patent number 8,098,687
- Issue date Jan 17, 2012
- Ralink Technology Corporation
- Ming Ta Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package structure of compound semiconductor device and fabricating...
- Patent number 7,893,528
- Issue date Feb 22, 2011
- Advanced Optoelectronic Technology, Inc.
- Pin Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of integrated circuit device and manufacturing me...
- Patent number 7,863,717
- Issue date Jan 4, 2011
- Advanced Optoelectronic Technology, Inc.
- Shih Hsiung Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of build-in self-diagnosis and repair in a mem...
- Patent number 7,228,468
- Issue date Jun 5, 2007
- Industrial Technology Research Institute
- Cheng-Wen Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Built-in jitter measurement circuit for voltage controlled oscillat...
- Patent number 6,937,106
- Issue date Aug 30, 2005
- Industrial Technology Research Institute
- Yeong-Jar Chang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WIRELESS FIDELITY DEVICE WITH DYNAMIC CAPABILITY ALLOCATION AND REL...
- Publication number 20220330225
- Publication date Oct 13, 2022
- MEDIATEK INC.
- Chien-Fang Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method and Communication Device of Beacon Reception
- Publication number 20180199285
- Publication date Jul 12, 2018
- MEDIATEK INC.
- Kuo-Chiang Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR REORDERING
- Publication number 20170222943
- Publication date Aug 3, 2017
- MEDIATEK Inc.
- YU-TING YAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM AND METHOD FOR GENERATING IONS IN AN ION SOURCE
- Publication number 20150206690
- Publication date Jul 23, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE AND MOLD OF MANUFACTURING THE SAME
- Publication number 20130122618
- Publication date May 16, 2013
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120037947
- Publication date Feb 16, 2012
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- CHAO-HSIUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT EMITTING DIODE
- Publication number 20120034716
- Publication date Feb 9, 2012
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE
- Publication number 20120025238
- Publication date Feb 2, 2012
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120025243
- Publication date Feb 2, 2012
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE OF LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120025240
- Publication date Feb 2, 2012
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING LIGHT EMITTING DEVICE
- Publication number 20120021542
- Publication date Jan 26, 2012
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20120021541
- Publication date Jan 26, 2012
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN BO LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE PACKAGE FOR MICROMINIATURIZATION
- Publication number 20120012873
- Publication date Jan 19, 2012
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LED PACKAGE AND SUBSTRATE THEREOF
- Publication number 20110256646
- Publication date Oct 20, 2011
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110215365
- Publication date Sep 8, 2011
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20110089464
- Publication date Apr 21, 2011
- ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
- SHEN BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20110062474
- Publication date Mar 17, 2011
- ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
- Pin Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING CONTINUOUS CHANNEL NOISE AND APPARATUS FOR USI...
- Publication number 20110038273
- Publication date Feb 17, 2011
- RALINK TECHNOLOGY CORPORATION
- MING TA LI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WATERPROOF SMD LED MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110031513
- Publication date Feb 10, 2011
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- MIN-TSUN HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF COMPOUND SEMICONDUCTOR DEVICE AND FABRICATING...
- Publication number 20100304535
- Publication date Dec 2, 2010
- ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
- PIN CHUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DISTRIBUTING KEYS AND APPARATUS FOR USING THE SAME
- Publication number 20100266130
- Publication date Oct 21, 2010
- RALINK TECHNOLOGY CORPORATION
- Shen Po LIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR FORWARDING PACKETS
- Publication number 20100183010
- Publication date Jul 22, 2010
- RALINK TECHNOLOGY CORPORATION
- Ming Ta Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CERAMIC PACKAGE STRUCTURE OF HIGH POWER LIGHT EMITTING DIODE AND MA...
- Publication number 20100090239
- Publication date Apr 15, 2010
- ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
- SHEN BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20100059785
- Publication date Mar 11, 2010
- ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
- SHEN BO LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE OF INTEGRATED CIRCUIT DEVICE AND MANUFACTURING ME...
- Publication number 20090224385
- Publication date Sep 10, 2009
- ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
- SHIH HSIUNG CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF COMPOUND SEMICONDUCTOR DEVICE AND FABRICATING...
- Publication number 20090206358
- Publication date Aug 20, 2009
- ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
- PIN CHUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF COMPOUND SEMICONDUCTOR DEVICE AND FABRICATING...
- Publication number 20090022198
- Publication date Jan 22, 2009
- ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
- PIN CHUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of build-in self-diagnosis and repair in a mem...
- Publication number 20060064618
- Publication date Mar 23, 2006
- Cheng-Wen Wu
- G11 - INFORMATION STORAGE
Information Patent Application
Built-in jitter measurement circuit for voltage controlled oscillat...
- Publication number 20050057312
- Publication date Mar 17, 2005
- Industrial Technology Research Institute
- Yeong-Jar Chang
- H03 - BASIC ELECTRONIC CIRCUITRY

Shen Bo Lin

Person

Patents Grantslast 30 patents

Method and communication device of beacon reception

System and method for generating ions in an ion source

LED package and mold of manufacturing the same

LED package with bounding dam surrounding LED chip and thermoset en...

Light emitting diode package and manufacturing method thereof

Light emitting diode package and method of fabricating the same

Package structure of compound semiconductor device and fabricating...

Method for manufacturing LED package and substrate thereof

Method and apparatus for forwarding packets

Package structure of compound semiconductor device and fabricating...

Package structure of integrated circuit device and manufacturing me...

Method and apparatus of build-in self-diagnosis and repair in a mem...

Built-in jitter measurement circuit for voltage controlled oscillat...

Patents Applicationslast 30 patents

WIRELESS FIDELITY DEVICE WITH DYNAMIC CAPABILITY ALLOCATION AND REL...

Method and Communication Device of Beacon Reception

METHOD AND APPARATUS FOR REORDERING

SYSTEM AND METHOD FOR GENERATING IONS IN AN ION SOURCE

LED PACKAGE AND MOLD OF MANUFACTURING THE SAME

LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE

LED PACKAGE

LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE OF LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF PACKAGING LIGHT EMITTING DEVICE

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

LIGHT EMITTING DIODE PACKAGE FOR MICROMINIATURIZATION

METHOD FOR MANUFACTURING LED PACKAGE AND SUBSTRATE THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME

LIGHT-EMITTING DIODE DEVICE AND FABRICATION METHOD THEREOF

METHOD FOR DETECTING CONTINUOUS CHANNEL NOISE AND APPARATUS FOR USI...

WATERPROOF SMD LED MODULE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE OF COMPOUND SEMICONDUCTOR DEVICE AND FABRICATING...

METHOD FOR DISTRIBUTING KEYS AND APPARATUS FOR USING THE SAME

METHOD AND APPARATUS FOR FORWARDING PACKETS

CERAMIC PACKAGE STRUCTURE OF HIGH POWER LIGHT EMITTING DIODE AND MA...

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE OF INTEGRATED CIRCUIT DEVICE AND MANUFACTURING ME...

PACKAGE STRUCTURE OF COMPOUND SEMICONDUCTOR DEVICE AND FABRICATING...

PACKAGE STRUCTURE OF COMPOUND SEMICONDUCTOR DEVICE AND FABRICATING...

Method and apparatus of build-in self-diagnosis and repair in a mem...

Built-in jitter measurement circuit for voltage controlled oscillat...