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Tainan City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
Patent number
11,984,465
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei Chuang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
Patent number
11,495,630
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Wei Chuang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density MIM capacitor structure
Patent number
11,139,367
Issue date
Oct 5, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Seiji Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
Patent number
10,861,894
Issue date
Dec 8, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Wei Chuang Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
Patent number
10,727,265
Issue date
Jul 28, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei Chuang Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
Patent number
10,461,109
Issue date
Oct 29, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei Chuang Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY
Publication number
20240282799
Publication date
Aug 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Kuan Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230420464
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Kuan Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE DEEP TRENCH ISOLATION (MDTI) STRUCTURE FOR CMOS IMAGE SENSOR
Publication number
20220384495
Publication date
Dec 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei Chuang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE DEEP TRENCH ISOLATION (MDTI) STRUCTURE FOR CMOS IMAGE SENSOR
Publication number
20200343281
Publication date
Oct 29, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Wei Chuang Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
HIGH DENSITY MIM CAPACITOR STRUCTURE
Publication number
20200135844
Publication date
Apr 30, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Seiji Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE DEEP TRENCH ISOLATION (MDTI) STRUCTURE FOR CMOS IMAGE SENSOR
Publication number
20200058686
Publication date
Feb 20, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Wei Chuang Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
MULTIPLE DEEP TRENCH ISOLATION (MDTI) STRUCTURE FOR CMOS IMAGE SENSOR
Publication number
20200058685
Publication date
Feb 20, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Wei Chuang Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
MULTIPLE DEEP TRENCH ISOLATION (MDTI) STRUCTURE FOR CMOS IMAGE SENSOR
Publication number
20190165009
Publication date
May 30, 2019
Taiwan Semiconductor Manufacturing Co., LTD
Wei Chuang Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE