Shen-Shen Wang

Person

Junghe City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode structure
- Patent number 7,291,863
- Issue date Nov 6, 2007
- National Central University
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and fabricating method thereof
- Patent number 7,265,389
- Issue date Sep 4, 2007
- National Central University
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic electroluminescent material and electroluminescent device b...
- Patent number 7,029,764
- Issue date Apr 18, 2006
- RiTdisplay Corporation
- Hsiang Lun Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic electroluminescent material and organic electroluminescent...
- Patent number 7,026,061
- Issue date Apr 11, 2006
- RiTdisplay Corporation
- Jui Hsiung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip interconnection structure and process of making the same
- Patent number 6,744,142
- Issue date Jun 1, 2004
- National Central University
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of fabricating flip chip interconnection structure
- Patent number 6,642,079
- Issue date Nov 4, 2003
- National Central University
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER COMPOSITION AND SOLDERING STRUCTURE
- Publication number 20070122646
- Publication date May 31, 2007
- Cheng-Yi Liu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF
- Publication number 20060141644
- Publication date Jun 29, 2006
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20060102925
- Publication date May 18, 2006
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20060019481
- Publication date Jan 26, 2006
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Organic electroluminescent device
- Publication number 20050236976
- Publication date Oct 27, 2005
- RiTdisplay Corporation
- Man-Kit Leung
- C07 - ORGANIC CHEMISTRY
Information Patent Application
[SOLDER COMPOSITION]
- Publication number 20050031483
- Publication date Feb 10, 2005
- Cheng-Yi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
[GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF]
- Publication number 20040183194
- Publication date Sep 23, 2004
- CHENG-YI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Organic electroluminescent material and organic electroluminescent...
- Publication number 20040183432
- Publication date Sep 23, 2004
- Jui Hsiung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Organic electroluminescent material and electroluminescent device b...
- Publication number 20040146742
- Publication date Jul 29, 2004
- Hsiang Lun Hsu
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Organic electroluminescent device and method for manufacturing the...
- Publication number 20040091741
- Publication date May 13, 2004
- Hsien-Chang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP INTERCONNCETION STRUCTURE AND PROCESS OF MAKING THE SAME
- Publication number 20030234453
- Publication date Dec 25, 2003
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Shen-Shen Wang

Person

Patents Grantslast 30 patents

Light emitting diode structure

Light emitting diode and fabricating method thereof

Organic electroluminescent material and electroluminescent device b...

Organic electroluminescent material and organic electroluminescent...

Flip chip interconnection structure and process of making the same

Process of fabricating flip chip interconnection structure

Patents Applicationslast 30 patents

SOLDER COMPOSITION AND SOLDERING STRUCTURE

LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF

LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF

GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF

Organic electroluminescent device

[SOLDER COMPOSITION]

[GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF]

Organic electroluminescent material and organic electroluminescent...

Organic electroluminescent material and electroluminescent device b...

Organic electroluminescent device and method for manufacturing the...

FLIP CHIP INTERCONNCETION STRUCTURE AND PROCESS OF MAKING THE SAME