Shenavia S. Howell

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with asymmetric adhesion material regions
- Patent number 11,682,605
- Issue date Jun 20, 2023
- Intel Corporation
- Karthik Visvanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-level backside metallization (BSM)
- Patent number 11,652,061
- Issue date May 16, 2023
- Intel Corporation
- Shenavia S. Howell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT
- Publication number 20210013117
- Publication date Jan 14, 2021
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-LEVEL BACKSIDE METALLIZATION (BSM)
- Publication number 20200395307
- Publication date Dec 17, 2020
- Intel Corporation
- Shenavia S. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH ASYMMETRIC ADHESION MATERIAL REGIONS
- Publication number 20200381334
- Publication date Dec 3, 2020
- Intel Corporation
- Karthik Visvanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR