Sheng Cheang Ch'ng

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Balik Pulau, MY

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Patents Grantslast 30 patents

Information Patent Grant
Apparatuses and methods for improving ball-grid-array solder joint...
- Patent number 7,375,288
- Issue date May 20, 2008
- Intel Corp.
- Sheng Cheang Ch'ng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR