Sheng-Chi CHEN

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Vessel power safety control system and operating method thereof
- Patent number 12,214,849
- Issue date Feb 4, 2025
- Ship and Ocean Industries R&D Center
- Bing-Xian Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Optical member driving mechanism
- Patent number 12,216,326
- Issue date Feb 4, 2025
- TDK TAIWAN CORP.
- Hsiang-Chin Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded backside memory on a field effect transistor
- Patent number 12,213,323
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process tool for analyzing bonded workpiece interface
- Patent number 12,205,855
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic circuits with reduced transistor counts
- Patent number 12,190,034
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Lin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure, back-side illuminated image sensor and met...
- Patent number 12,183,761
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM MTJ with directly coupled top electrode connection
- Patent number 12,185,640
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chau Chen
Information Patent Grant
Optical element driving mechanism
- Patent number 12,181,775
- Issue date Dec 31, 2024
- TDK TAIWAN CORP.
- Chin-Ming Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,183,779
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure for CMOS image sensors including through-substrat...
- Patent number 12,176,370
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric structure overlying image sensor element to increase qua...
- Patent number 12,176,372
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, non-transitory computer-readable medium, and apparatus for...
- Patent number 12,164,854
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ting-Chi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,637
- Issue date Nov 12, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Cheng-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trim wall protection method for multi-wafer stacking
- Patent number 12,125,763
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 12,113,090
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and performance optimization method thereof
- Patent number 12,093,111
- Issue date Sep 17, 2024
- ASUSTeK COMPUTER Inc.
- Po-Han Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit having a high cell density
- Patent number 12,087,690
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Protective wafer grooving structure for wafer thinning and methods...
- Patent number 12,087,756
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,089,349
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cell region including portion of conductor of another cell region a...
- Patent number 12,079,561
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Magnetic random access memory device and formation method thereof
- Patent number 12,069,963
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
Information Patent Grant
Scan flip-flops with pre-setting combinational logic
- Patent number 12,066,489
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Johnny Chiahao Li
- G01 - MEASURING TESTING
Information Patent Grant
Pin modification for standard cells
- Patent number 12,056,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for generating images with high dynamic range during multipl...
- Patent number 12,051,180
- Issue date Jul 30, 2024
- Chiun Mai Communication Systems, Inc.
- Sheng-Yeh Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three dimensional MIM capacitor having a comb structure and methods...
- Patent number 12,046,550
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Paul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite deep trench isolation structure in an image sensor
- Patent number 12,027,554
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer for memory device formation
- Patent number 12,027,420
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huang Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Weather-resistant LED assembly
- Patent number 12,018,830
- Issue date Jun 25, 2024
- SCT LTD.
- Eric Li
- F21 - LIGHTING
Information Patent Grant
Integrated circuit and method of forming same and a system
- Patent number 12,014,131
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device and method
- Patent number 12,014,982
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yu Lin
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250048693
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250031459
- Publication date Jan 23, 2025
- InnoLux Corporation
- Han-Tsung SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-INVASIVE BLOOD GLUCOSE MONITORING DEVICE
- Publication number 20250025051
- Publication date Jan 23, 2025
- Taiwan-Asia Semiconductor Corporation
- Hsiu-Jung HUANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MULTI-WAFER STACKED CMOS IMAGE SENSOR STRUCTURE
- Publication number 20250008244
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Hsien Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404877
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240395843
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY
- Publication number 20240395785
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having a High Cell Density
- Publication number 20240387373
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR ADJUSTING THE GAP BETWEEN A WAFER AND A TOP P...
- Publication number 20240387299
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chan LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION
- Publication number 20240387148
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Alloy with Ultra-High Thermal Conductivity and Manufacturi...
- Publication number 20240376571
- Publication date Nov 14, 2024
- CHARNG CHYI ALUMINUM CO., LTD.
- SHENG-I CHEN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE
- Publication number 20240379468
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR
- Publication number 20240381667
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFO...
- Publication number 20240379721
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240371922
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION
- Publication number 20240371666
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MANUFACTURING METHOD
- Publication number 20240370633
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRIM WALL PROTECTION METHOD FOR MULTI-WAFER STACKING
- Publication number 20240363469
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY DEVICE AND FORMATION METHOD THEREOF
- Publication number 20240365682
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay CHUANG
Information Patent Application
Scan Flip-Flops With Pre-Setting Combinational Logic
- Publication number 20240361383
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Johnny Chiahao Li
- G01 - MEASURING TESTING
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20240363613
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMATION
- Publication number 20240363652
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20240355864
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN MODIFICATION FOR STANDARD CELLS
- Publication number 20240354487
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL STRUCTURE
- Publication number 20240345299
- Publication date Oct 17, 2024
- VisEra Technologies Company Limited
- Cheng-Ta MU
- G02 - OPTICS
Information Patent Application
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
- Publication number 20240339422
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING SAME AND A SYSTEM
- Publication number 20240338511
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Hsiung CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD
- Publication number 20240332174
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE DIMENSIONAL MIM CAPACITOR HAVING A COMB STRUCTURE AND METHODS...
- Publication number 20240332163
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS

Sheng-Chi CHEN

Person

Patents Grantslast 30 patents

Vessel power safety control system and operating method thereof

Optical member driving mechanism

Embedded backside memory on a field effect transistor

Process tool for analyzing bonded workpiece interface

Logic circuits with reduced transistor counts

Semiconductor structure, back-side illuminated image sensor and met...

MRAM MTJ with directly coupled top electrode connection

Optical element driving mechanism

Integrated circuit and method of forming the same

Stacked structure for CMOS image sensors including through-substrat...

Dielectric structure overlying image sensor element to increase qua...

Method, non-transitory computer-readable medium, and apparatus for...

Semiconductor device and method of manufacturing the same

Trim wall protection method for multi-wafer stacking

Bond pad structure for bonding improvement

Electronic device and performance optimization method thereof

Integrated circuit having a high cell density

Protective wafer grooving structure for wafer thinning and methods...

Semiconductor device package and method of manufacturing the same

Cell region including portion of conductor of another cell region a...

Magnetic random access memory device and formation method thereof

Scan flip-flops with pre-setting combinational logic

Pin modification for standard cells

Method for generating images with high dynamic range during multipl...

Three dimensional MIM capacitor having a comb structure and methods...

Composite deep trench isolation structure in an image sensor

Etch stop layer for memory device formation

Weather-resistant LED assembly

Integrated circuit and method of forming same and a system

Integrated circuit device and method

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

NON-INVASIVE BLOOD GLUCOSE MONITORING DEVICE

MULTI-WAFER STACKED CMOS IMAGE SENSOR STRUCTURE

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY

Integrated Circuit Having a High Cell Density

METHOD AND SYSTEM FOR ADJUSTING THE GAP BETWEEN A WAFER AND A TOP P...

TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION

Aluminum Alloy with Ultra-High Thermal Conductivity and Manufacturi...

PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE

EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR

HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFO...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION

INTEGRATED CIRCUIT MANUFACTURING METHOD

TRIM WALL PROTECTION METHOD FOR MULTI-WAFER STACKING

MAGNETIC RANDOM ACCESS MEMORY DEVICE AND FORMATION METHOD THEREOF

Scan Flip-Flops With Pre-Setting Combinational Logic

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMATION

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

PIN MODIFICATION FOR STANDARD CELLS

OPTICAL STRUCTURE

SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION

INTEGRATED CIRCUIT AND METHOD OF FORMING SAME AND A SYSTEM

INTEGRATED CIRCUIT DEVICE AND METHOD

THREE DIMENSIONAL MIM CAPACITOR HAVING A COMB STRUCTURE AND METHODS...