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Sheng-Chi Tsai
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Kaohsiung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Spiral bevel gear forging apparatus
Patent number
9,403,207
Issue date
Aug 2, 2016
Metal Industries Research & Development Centre
Can-Xun Chang
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Grant
Mold set for manufacturing case and the method thereof
Patent number
8,528,376
Issue date
Sep 10, 2013
Metal Industries Research & Development Centre
Ming-Fu Li
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Flip chip package with anti-floating structure
Patent number
7,368,806
Issue date
May 6, 2008
Advanced Semiconductor Engineering, Inc.
Chien Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame structure
Patent number
6,204,553
Issue date
Mar 20, 2001
Walsin Advanced Electronics Ltd.
Wen-Chun Liu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SPIRAL BEVEL GEAR FORGING APPARATUS
Publication number
20160144422
Publication date
May 26, 2016
Metal Industries Research & Development Centre
Can-Xun Chang
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Application
MOLD SET FOR MANUFACTURING CASE AND THE METHOD THEREOF
Publication number
20110155341
Publication date
Jun 30, 2011
Metal Industries Research & Development Centre
Ming-Fu LI
B22 - CASTING POWDER METALLURGY
Information
Patent Application
FLIP CHIP PACKAGE WITH ANTI-FLOATING STRUCTURE
Publication number
20080179739
Publication date
Jul 31, 2008
Advanced Semiconductor Engineering, Inc.
Chien Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip chip package with anti-floating structure
Publication number
20060125113
Publication date
Jun 15, 2006
Chien Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Processing method during a package process
Publication number
20060084199
Publication date
Apr 20, 2006
Advanced Semiconductor Engineering, Inc.
Chien Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer Level Process for Manufacturing Leadframes and Device from th...
Publication number
20060084202
Publication date
Apr 20, 2006
Chien Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for bonding flip chip on leadframe
Publication number
20060051894
Publication date
Mar 9, 2006
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Chien Liu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR