Sheng-Hua Wu

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Immersion cooling system and cooling method thereof
- Patent number 12,150,275
- Issue date Nov 19, 2024
- Delta Electronics, Inc.
- Li-Hsiu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 12,074,137
- Issue date Aug 27, 2024
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contamination control in semiconductor manufacturing systems
- Patent number 12,020,964
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo Chen Chen
- B08 - CLEANING
Information Patent Grant
Method and system for sport game video processing
- Patent number 12,020,481
- Issue date Jun 25, 2024
- Industrial Technology Research Institute
- Feng-Sheng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated antenna package structure
- Patent number 12,009,341
- Issue date Jun 11, 2024
- Industrial Technology Research Institute
- Po-Kai Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of displaying rear-view image and mobile device using the same
- Patent number 11,988,831
- Issue date May 21, 2024
- Kinpo Electronics, Inc.
- Yu Chi Chen
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System, non-transitory computer readable storage medium and method...
- Patent number 11,979,620
- Issue date May 7, 2024
- Industrial Technology Research Institute
- Sheng-Han Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wafer cleaning
- Patent number 11,958,090
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo Chen Chen
- B08 - CLEANING
Information Patent Grant
Apparatus and method of manufacturing a semiconductor device
- Patent number 11,935,728
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer drying system
- Patent number 11,927,392
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,818
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray reflectometry apparatus and method thereof for measuring thre...
- Patent number 11,867,595
- Issue date Jan 9, 2024
- Industrial Technology Research Institute
- Chun-Ting Liu
- G01 - MEASURING TESTING
Information Patent Grant
Package substrate and method of fabricating the same and chip packa...
- Patent number 11,854,961
- Issue date Dec 26, 2023
- Industrial Technology Research Institute
- Yu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,812,646
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yu Wu
Information Patent Grant
Apparatus and method for wafer cleaning
- Patent number 11,766,703
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo Chen Chen
- A46 - BRUSHWARE
Information Patent Grant
Composite cleat
- Patent number 11,744,330
- Issue date Sep 5, 2023
- COMPLAM MATERIAL CO., LTD.
- Chia Yang Lu
- A43 - FOOTWEAR
Information Patent Grant
Control method for optical tracking system
- Patent number 11,714,162
- Issue date Aug 1, 2023
- HTC Corporation
- Mong-Yu Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of halogen-free flame-retardant thermoplastic...
- Patent number 11,691,354
- Issue date Jul 4, 2023
- COMPLAM MATERIAL CO., LTD.
- Chia yang Lu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,646,270
- Issue date May 9, 2023
- Industrial Technology Research Institute
- Ang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hinge capable of widely expanding
- Patent number 11,640,188
- Issue date May 2, 2023
- Sinher Technology Inc.
- Ting-Hung Su
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Data display method of test instrument for rivet nut setting tool
- Patent number 11,614,374
- Issue date Mar 28, 2023
- SOL AL TECHNOLOGY CO., LTD.
- Sheng-Yuan Wu
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Current sensing correction method and driving system using same
- Patent number 11,611,300
- Issue date Mar 21, 2023
- Delta Electronics, Inc.
- Shao-Kai Tseng
- G01 - MEASURING TESTING
Information Patent Grant
Method of detecting connection fault of electric motor
- Patent number 11,611,303
- Issue date Mar 21, 2023
- Delta Electronics, Inc.
- Shao-Kai Tseng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,587,905
- Issue date Feb 21, 2023
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray reflectometry apparatus and method thereof for measuring thre...
- Patent number 11,579,099
- Issue date Feb 14, 2023
- Industrial Technology Research Institute
- Chun-Ting Liu
- G01 - MEASURING TESTING
Information Patent Grant
Wafer drying system
- Patent number 11,581,199
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover ring and ground shield for physical vapor deposition chamber
- Patent number 11,569,071
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Cheng Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PHYSICAL VAPOR DEPOSITION (PVD) SYSTEM AND METHOD OF PROCESSING TARGET
- Publication number 20240376592
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Ying WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF SUBSTRATE PROCESSING AND METHODS OF MANUFACTURING SEMICO...
- Publication number 20240376600
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Cheng WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Contamination Control In Semiconductor Manufacturing Systems
- Publication number 20240304481
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo Chen CHEN
- B08 - CLEANING
Information Patent Application
LIGHT-EMITTING DEVICE AND ELECTRICAL MODULE THEREOF
- Publication number 20240276641
- Publication date Aug 15, 2024
- Lextar Electronics Corporation
- Sheng-Ta WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240250210
- Publication date Jul 25, 2024
- EPISTAR CORPORATION
- Chia-Che LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240242942
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240213165
- Publication date Jun 27, 2024
- PowerX Semiconductor Corporation
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID ELECTROLYTE FILM AND BATTERY EMPLOYING THE SAME
- Publication number 20240213550
- Publication date Jun 27, 2024
- Industrial Technology Research Institute
- Kuan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOTOR
- Publication number 20240213835
- Publication date Jun 27, 2024
- NIDEC CORPORATION
- Hsiu-Ying LIN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COMPOSITE METAL FOIL AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240167185
- Publication date May 23, 2024
- Industrial Technology Research Institute
- Chiu-Yen Chiu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus And Method For Wafer Cleaning
- Publication number 20240157412
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo Chen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY PROJECTION LENS
- Publication number 20240085667
- Publication date Mar 14, 2024
- SUN YANG OPTICS DEVELOPMENT CO., LTD.
- SHENG CHE WU
- G02 - OPTICS
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20240074119
- Publication date Feb 29, 2024
- Delta Electronics, Inc.
- Ren-Chun CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND METAL CLAD SUBSTRATE
- Publication number 20240017525
- Publication date Jan 18, 2024
- ITEQ CORPORATION
- SHENG-YEN WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND METAL CLAD SUBSTRATE
- Publication number 20240002653
- Publication date Jan 4, 2024
- ITEQ CORPORATION
- SHENG-YEN WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WAFER DRYING SYSTEM
- Publication number 20230384030
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING SYSTEM AND COOLING METHOD THEREOF
- Publication number 20230389231
- Publication date Nov 30, 2023
- Delta Electronics, Inc.
- Li-Hsiu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUGHENED RESIN COMPOSITION
- Publication number 20230348708
- Publication date Nov 2, 2023
- ITEQ CORPORATION
- Sheng-Yen WU
- B32 - LAYERED PRODUCTS
Information Patent Application
TOUGHENED RESIN COMPOSITION
- Publication number 20230348673
- Publication date Nov 2, 2023
- ITEQ CORPORATION
- Sheng-Yen WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF DISPLAYING REAR-VIEW IMAGE AND MOBILE DEVICE USING THE SAME
- Publication number 20230341681
- Publication date Oct 26, 2023
- KINPO ELECTRONICS, INC.
- Yu Chi Chen
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD OF DISPLAYING REAR-VIEW IMAGE AND DIGITAL DASHBOARD USING TH...
- Publication number 20230339403
- Publication date Oct 26, 2023
- KINPO ELECTRONICS, INC.
- Yu Chi Chen
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD OF USING MOBILE DEVICE AS DASHBOARD OF MOTORCYCLE AND MOTORC...
- Publication number 20230339322
- Publication date Oct 26, 2023
- KINPO ELECTRONICS, INC.
- Yu Chi Chen
- B60 - VEHICLES IN GENERAL
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
- Publication number 20230253358
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL LENS
- Publication number 20230251470
- Publication date Aug 10, 2023
- SUN YANG OPTICS DEVELOPMENT CO., LTD.
- SHENG DA JIANG
- G02 - OPTICS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20230197578
- Publication date Jun 22, 2023
- Industrial Technology Research Institute
- Tai-Jyun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ANTENNA PACKAGE STRUCTURE
- Publication number 20230197680
- Publication date Jun 22, 2023
- Industrial Technology Research Institute
- Po-Kai Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM AND METHOD...
- Publication number 20230199233
- Publication date Jun 22, 2023
- Industrial Technology Research Institute
- SHENG-HAN WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187409
- Publication date Jun 15, 2023
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS

Sheng-Hua Wu

Person

Patents Grantslast 30 patents

Immersion cooling system and cooling method thereof

Multi-chip package and manufacturing method thereof

Contamination control in semiconductor manufacturing systems

Method and system for sport game video processing

Integrated antenna package structure

Method of displaying rear-view image and mobile device using the same

System, non-transitory computer readable storage medium and method...

Solderless interconnection structure and method of forming same

Apparatus and method for wafer cleaning

Apparatus and method of manufacturing a semiconductor device

Wafer drying system

Semiconductor device

X-ray reflectometry apparatus and method thereof for measuring thre...

Package substrate and method of fabricating the same and chip packa...

Connector structure and method of forming same

Display device and manufacturing method thereof

Apparatus and method for wafer cleaning

Composite cleat

Control method for optical tracking system

Manufacturing method of halogen-free flame-retardant thermoplastic...

Bump-on-trace design for enlarge bump-to-trace distance

Multi-chip package and manufacturing method thereof

Hinge capable of widely expanding

Data display method of test instrument for rivet nut setting tool

Current sensing correction method and driving system using same

Method of detecting connection fault of electric motor

Multi-chip package and manufacturing method thereof

X-ray reflectometry apparatus and method thereof for measuring thre...

Wafer drying system

Cover ring and ground shield for physical vapor deposition chamber

Patents Applicationslast 30 patents

PHYSICAL VAPOR DEPOSITION (PVD) SYSTEM AND METHOD OF PROCESSING TARGET

METHODS OF SUBSTRATE PROCESSING AND METHODS OF MANUFACTURING SEMICO...

Contamination Control In Semiconductor Manufacturing Systems

LIGHT-EMITTING DEVICE AND ELECTRICAL MODULE THEREOF

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

POWER MODULE

SOLID ELECTROLYTE FILM AND BATTERY EMPLOYING THE SAME

MOTOR

COMPOSITE METAL FOIL AND METHOD OF MANUFACTURING THE SAME

Apparatus And Method For Wafer Cleaning

PHOTOLITHOGRAPHY PROJECTION LENS

IMMERSION COOLING SYSTEM

RESIN COMPOSITION AND METAL CLAD SUBSTRATE

RESIN COMPOSITION AND METAL CLAD SUBSTRATE

WAFER DRYING SYSTEM

IMMERSION COOLING SYSTEM AND COOLING METHOD THEREOF

TOUGHENED RESIN COMPOSITION

TOUGHENED RESIN COMPOSITION

METHOD OF DISPLAYING REAR-VIEW IMAGE AND MOBILE DEVICE USING THE SAME

METHOD OF DISPLAYING REAR-VIEW IMAGE AND DIGITAL DASHBOARD USING TH...

METHOD OF USING MOBILE DEVICE AS DASHBOARD OF MOTORCYCLE AND MOTORC...

CHIP-ON-FILM PACKAGE

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

OPTICAL LENS

POWER SEMICONDUCTOR DEVICE

INTEGRATED ANTENNA PACKAGE STRUCTURE

SYSTEM, NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM AND METHOD...

MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF