Sheng-Jie Syu

Person

  • Taipei City, TW

Patents Grantslast 30 patents

  • Information Patent Grant

    Zero-configuration system and method for network devices

    • Patent number 9,232,410
    • Issue date Jan 5, 2016
    • D-Link Corporation
    • Sheng-Jie Syu
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    Heat sink structure

    • Patent number 7,946,336
    • Issue date May 24, 2011
    • Inventec Corporation
    • Feng-Ku Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device and heat sink thereof

    • Patent number 7,940,528
    • Issue date May 10, 2011
    • Inventec Corporation
    • Feng-Ku Wang
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Heat dissipating module

    • Patent number 7,835,152
    • Issue date Nov 16, 2010
    • Inventec Corporation
    • Shaw-Fuu Wang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Heat dissipation device

    • Patent number 7,826,227
    • Issue date Nov 2, 2010
    • Inventec Corporation
    • Feng-Ku Wang
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Heat dissipation module

    • Patent number 7,775,778
    • Issue date Aug 17, 2010
    • Inventec Corporation
    • Shaw-Fuu Wang
    • F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
  • Information Patent Grant

    Swing type fan

    • Patent number 7,621,725
    • Issue date Nov 24, 2009
    • Inventec Corporation
    • Ting-Chiang Huang
    • F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
  • Information Patent Grant

    Heat dissipation device

    • Patent number 7,619,894
    • Issue date Nov 17, 2009
    • Inventec Corporation
    • Shaw-Fuu Wang
    • F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...

Patents Applicationslast 30 patents

  • Information Patent Application

    ZERO-CONFIGURATION SYSTEM AND METHOD FOR NETWORK DEVICES

    • Publication number 20140040443
    • Publication date Feb 6, 2014
    • D-Link Corporation
    • Sheng-Jie SYU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    HEAT DISSIPATING DEVICE

    • Publication number 20120125570
    • Publication date May 24, 2012
    • Inventec Corporation
    • Feng-Ku WANG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT DISSIPATING MODULE

    • Publication number 20100124026
    • Publication date May 20, 2010
    • Inventec Corporation
    • Shaw-Fuu Wang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    ELECTRONIC DEVICE AND HEAT SINK THEREOF

    • Publication number 20100053892
    • Publication date Mar 4, 2010
    • Inventec Corporation
    • Feng-Ku WANG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP HEAT PIPE

    • Publication number 20090321055
    • Publication date Dec 31, 2009
    • Inventec Corporation
    • FENG-KU WANG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Heat sink structure

    • Publication number 20090211729
    • Publication date Aug 27, 2009
    • Inventec Corporation
    • Feng-Ku Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEAT DISSIPATION DEVICE

    • Publication number 20090213555
    • Publication date Aug 27, 2009
    • Inventec Corporation
    • Shaw-Fuu WANG
    • F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
  • Information Patent Application

    Heat dissipation device

    • Publication number 20090201647
    • Publication date Aug 13, 2009
    • Inventec Corporation
    • Feng-Ku Wang
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    SWING TYPE FAN

    • Publication number 20090047152
    • Publication date Feb 19, 2009
    • Inventec Corporation
    • Ting-Chiang Huang
    • F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
  • Information Patent Application

    HEAT DISSIPATION MODULE

    • Publication number 20090004963
    • Publication date Jan 1, 2009
    • Inventec Corporation
    • Shaw-Fuu Wang
    • F24 - HEATING RANGES VENTILATING