Sheng-Li Lu

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Taichung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating electronic package
- Patent number 10,199,320
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 9,818,683
- Issue date Nov 14, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having light-emitting-diode solder-bonded on...
- Patent number 8,970,053
- Issue date Mar 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Yuen-Han Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING ELECTRONIC PACKAGE
- Publication number 20180040550
- Publication date Feb 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170148716
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170040248
- Publication date Feb 9, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130214310
- Publication date Aug 22, 2013
- Siliconware Precision Industries Co., Ltd.
- Yuen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP STRUCTURE, PACKAGING SUBSTRATE, PACKAGE STRUCTURE AND FABR...
- Publication number 20130175563
- Publication date Jul 11, 2013
- Siliconware Precision Industries Co., Ltd.
- Yuen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS