Sheng-Lin MA

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level ultrasonic chip module and manufacturing method thereof
- Patent number 11,590,536
- Issue date Feb 28, 2023
- Peking University Shenzhen Graduate School
- Yu-Feng Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level ultrasonic chip module having suspension structure and...
- Patent number 11,478,822
- Issue date Oct 25, 2022
- J-Metrics Technology Co., Ltd.
- Yu-Feng Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale ultrasonic sensor assembly and method for manufacturing...
- Patent number 11,460,341
- Issue date Oct 4, 2022
- J-Metrics Technology Co., Ltd.
- Yu-Feng Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated package structure for MEMS element and ASIC chip and met...
- Patent number 11,130,674
- Issue date Sep 28, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer scale ultrasonic sensing device and manufacturing method thereof
- Patent number 11,075,072
- Issue date Jul 27, 2021
- J-Metrics Technology Co., Ltd.
- Yu-Feng Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic module and method for manufacturing the same
- Patent number 10,657,349
- Issue date May 19, 2020
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng Jin
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL ULTRASONIC CHIP MODULE HAVING SUSPENSION STRUCTURE
- Publication number 20230014827
- Publication date Jan 19, 2023
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng Jin
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
WAFER SCALE ULTRASONIC SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210013026
- Publication date Jan 14, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng JIN
- B24 - GRINDING POLISHING
Information Patent Application
INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND MET...
- Publication number 20200262700
- Publication date Aug 20, 2020
- J-METRICS TECHNOLOGY Co., Ltd.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER SCALE ULTRASONIC SENSOR ASSEMBLY AND METHOD FOR MANUFACTURING...
- Publication number 20200191646
- Publication date Jun 18, 2020
- J-METRICS TECHNOLOGY Co., Ltd. & Peking University Shenzhen Graduate School
- Yu-Feng Jin
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
WAFER LEVEL ULTRASONIC CHIP MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20200179979
- Publication date Jun 11, 2020
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng JIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER LEVEL ULTRASONIC CHIP MODULE HAVING SUSPENSION STRUCTURE AND...
- Publication number 20200164406
- Publication date May 28, 2020
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng JIN
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
ULTRASONIC MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190080132
- Publication date Mar 14, 2019
- J-METRICS TECHNOLOGY Co., Ltd.
- Yu-Feng JIN
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Sheng-Lin MA

Person

Patents Grantslast 30 patents

Wafer level ultrasonic chip module and manufacturing method thereof

Wafer level ultrasonic chip module having suspension structure and...

Wafer scale ultrasonic sensor assembly and method for manufacturing...

Integrated package structure for MEMS element and ASIC chip and met...

Wafer scale ultrasonic sensing device and manufacturing method thereof

Ultrasonic module and method for manufacturing the same

Patents Applicationslast 30 patents

WAFER LEVEL ULTRASONIC CHIP MODULE HAVING SUSPENSION STRUCTURE

WAFER SCALE ULTRASONIC SENSING DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND MET...

WAFER SCALE ULTRASONIC SENSOR ASSEMBLY AND METHOD FOR MANUFACTURING...

WAFER LEVEL ULTRASONIC CHIP MODULE AND MANUFACTURING METHOD THEREOF

WAFER LEVEL ULTRASONIC CHIP MODULE HAVING SUSPENSION STRUCTURE AND...

ULTRASONIC MODULE AND METHOD FOR MANUFACTURING THE SAME