-
-
-
-
Optical sensor package assembly
-
Publication number 20230309245
-
Publication date Sep 28, 2023
-
Luxsentek Microelectronics Corp.
-
Sheng-Cheng Lee
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
CHIP RELIABILITY TEST ASSEMBLY
-
Publication number 20230258710
-
Publication date Aug 17, 2023
-
Luxsentek Microelectronics Corp.
-
CHAO-YANG HSIAO
-
G01 - MEASURING TESTING
-
-
-
-
-
-
-
-
PROXIMITY SENSING DEVICE
-
Publication number 20230020275
-
Publication date Jan 19, 2023
-
Luxsentek Microelectronics Corp.
-
WEN-SHENG LIN
-
G01 - MEASURING TESTING
-
-
COMPOSITE MATERIAL STRUCTURE
-
Publication number 20220332087
-
Publication date Oct 20, 2022
-
Compal Electronics, Inc.
-
Han-Ching Huang
-
B32 - LAYERED PRODUCTS
-
-
-
-
-
-
-
ON-CHIP INDUCTOR STRUCTURE
-
Publication number 20210126085
-
Publication date Apr 29, 2021
-
VIA Labs, INC.
-
Sheng-Yuan Lee
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
GAME MACHINE
-
Publication number 20190358534
-
Publication date Nov 28, 2019
-
Compal Electronics, Inc.
-
Hao-Jen Fang
-
A63 - SPORTS GAMES AMUSEMENTS
-
STAND DEVICE
-
Publication number 20190346080
-
Publication date Nov 14, 2019
-
Compal Electronics, Inc.
-
Chen-Cheng Wang
-
F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
-