SHENG-WEI YEH

Person

TAICHUNG CITY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Gate structure and semiconductor device having the same
- Patent number 12,166,126
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 11,502,050
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure, method of forming the same, and semiconductor devic...
- Patent number 11,411,112
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a redistribution line
- Patent number 11,373,970
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,916,517
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,658,315
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure and fabrication method therefor
- Patent number 10,541,218
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad process with protective layer
- Patent number 10,354,965
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling semiconductor deposition operation
- Patent number 10,113,228
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Liang Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
- Publication number 20240381776
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHENG KAI YEH
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRANSDUCER AND METHOD FOR FORMING THE SAME
- Publication number 20240050987
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HSIEN YANG
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230386948
- Publication date Nov 30, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- You-Ru Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
- Publication number 20230320227
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-HUI LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM SUCTION WALL-CLIMBING ROBOT
- Publication number 20230234654
- Publication date Jul 27, 2023
- Industrial Technology Research Institute
- Chao-Jen LI
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20230072507
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME
- Publication number 20220336653
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
- Publication number 20220302060
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20210159196
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STRUCTURE, METHOD OF FORMING THE SAME, AND SEMICONDUCTOR DEVIC...
- Publication number 20210036147
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
- Publication number 20200152589
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20200144208
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20190304939
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Pad Process with Protective Layer
- Publication number 20190096834
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20180151525
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING SEMICONDUCTOR DEPOSITION OPERATION
- Publication number 20150371847
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUNG-LIANG CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

SHENG-WEI YEH

Person

Patents Grantslast 30 patents

Gate structure and semiconductor device having the same

Redistribution layer metallic structure and method

Redistribution layer metallic structure and method

Gate structure, method of forming the same, and semiconductor devic...

Semiconductor device having a redistribution line

Redistribution layer metallic structure and method

Redistribution layer metallic structure and method

Redistribution layer structure and fabrication method therefor

Bonding pad process with protective layer

Method for controlling semiconductor deposition operation

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE WITH TRANSDUCER AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

VACUUM SUCTION WALL-CLIMBING ROBOT

Redistribution Layer Metallic Structure and Method

GATE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

Redistribution Layer Metallic Structure and Method

GATE STRUCTURE, METHOD OF FORMING THE SAME, AND SEMICONDUCTOR DEVIC...

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

Redistribution Layer Metallic Structure and Method

Redistribution Layer Metallic Structure and Method

Bonding Pad Process with Protective Layer

REDISTRIBUTION LAYER STRUCTURE AND FABRICATION METHOD THEREFOR

METHOD FOR CONTROLLING SEMICONDUCTOR DEPOSITION OPERATION