Sheng-Yi Su

Follow

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure
- Patent number 10,446,489
- Issue date Oct 15, 2019
- United Microelectronics Corp.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and fabrication method thereof
- Patent number 10,153,231
- Issue date Dec 11, 2018
- United Microelectronics Corp.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming copper material over substrate
- Patent number 10,079,177
- Issue date Sep 18, 2018
- United Microelectronics Corp.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING INTERCONNECT OF SEMICONDUCTOR DEVICE
- Publication number 20200168450
- Publication date May 28, 2020
- United Microelectronics Corp.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20190067184
- Publication date Feb 28, 2019
- UNITED MICROELECTRONICS CORP.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20180261537
- Publication date Sep 13, 2018
- UNITED MICROELECTRONICS CORP.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS