Sheng ZHANG

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,278,210
- Issue date Apr 15, 2025
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chips bonding auxiliary structure
- Patent number 12,266,578
- Issue date Apr 1, 2025
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,249,607
- Issue date Mar 11, 2025
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,605,648
- Issue date Mar 14, 2023
- UNITED MICROELECTRONICS CORP.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring chips bonding strength and chips bonding auxil...
- Patent number 11,456,221
- Issue date Sep 27, 2022
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,622,253
- Issue date Apr 14, 2020
- United Microelectronics Corp.
- Li-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging method
- Patent number 10,580,823
- Issue date Mar 3, 2020
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device for reducing grain siz...
- Patent number 9,852,912
- Issue date Dec 26, 2017
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash cell structure and method of fabricating the same
- Patent number 9,780,101
- Issue date Oct 3, 2017
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20230411343
- Publication date Dec 21, 2023
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230154926
- Publication date May 18, 2023
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230094739
- Publication date Mar 30, 2023
- UNITED MICROELECTRONICS CORP.
- Chunyuan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415926
- Publication date Dec 29, 2022
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING CHIPS BONDING STRENGTH AND CHIPS BONDING AUXIL...
- Publication number 20220399239
- Publication date Dec 15, 2022
- United Microelectronics Corp.
- Sheng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING CHIPS BONDING STRENGTH AND CHIPS BONDING AUXIL...
- Publication number 20210358818
- Publication date Nov 18, 2021
- United Microelectronics Corp.
- Sheng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190378757
- Publication date Dec 12, 2019
- United Microelectronics Corp.
- Li-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING METHOD
- Publication number 20180323227
- Publication date Nov 8, 2018
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING METHOD
- Publication number 20140342473
- Publication date Nov 20, 2014
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REMOVING PHOTORESIST LAYER AND METHOD OF FABRICATING SEMI...
- Publication number 20080261384
- Publication date Oct 23, 2008
- United Microelectronics Corp.
- Zhi-Qiang Sun
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Sheng ZHANG

Person

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure

Chips bonding auxiliary structure

Semiconductor structure

Semiconductor structure and manufacturing method thereof

Method for measuring chips bonding strength and chips bonding auxil...

Manufacturing method of semiconductor device

Wafer level packaging method

Method of manufacturing semiconductor device for reducing grain siz...

Flash cell structure and method of fabricating the same

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE

SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR MEASURING CHIPS BONDING STRENGTH AND CHIPS BONDING AUXIL...

METHOD FOR MEASURING CHIPS BONDING STRENGTH AND CHIPS BONDING AUXIL...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

WAFER LEVEL PACKAGING METHOD

SEMICONDUCTOR PROCESSING METHOD

METHOD OF REMOVING PHOTORESIST LAYER AND METHOD OF FABRICATING SEMI...