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Shengquan E. Ou

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  • Chandler, AZ, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20240128256
    • Publication date Apr 18, 2024
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20220231007
    • Publication date Jul 21, 2022
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20220157803
    • Publication date May 19, 2022
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20200395352
    • Publication date Dec 17, 2020
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20190371778
    • Publication date Dec 5, 2019
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURES TO MITIGATE CONTAMINATION ON A BACK SIDE OF A SEMICONDUC...
    • Publication number 20170186707
    • Publication date Jun 29, 2017
    • Intel Corporation
    • Xavier F. BRUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE CONNECTIONS USING DIFFERENT UNDERFILL TYPES FOR DIFFERENT REGIONS
    • Publication number 20150001736
    • Publication date Jan 1, 2015
    • Hualiang Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLUTION TO DEAL WITH DIE WARPAGE DURING 3D DIE-TO-DIE STACKING
    • Publication number 20150001740
    • Publication date Jan 1, 2015
    • Hualiang SHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT JOINT
    • Publication number 20090020869
    • Publication date Jan 22, 2009
    • Qing Xue
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...