Shengquan WANG

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Ezhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Liquid epoxy molding compound and preparation method thereof
- Patent number 12,209,171
- Issue date Jan 28, 2025
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De Wu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid molding compound and preparation method thereof
- Patent number 12,037,488
- Issue date Jul 16, 2024
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De Wu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfill for chip packaging and chip packaging structure
- Patent number 11,804,463
- Issue date Oct 31, 2023
- Wuhan Choice Technology Co, Ltd
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid molding compound for protecting five edges of semiconductor...
- Patent number 11,643,499
- Issue date May 9, 2023
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De Wu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
LIQUID EPOXY MOLDING COMPOUND AND PREPARATION METHOD THEREOF
- Publication number 20240425669
- Publication date Dec 26, 2024
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
UNDERFILL FOR CHIP PACKAGING AND CHIP PACKAGING STRUCTURE
- Publication number 20230260948
- Publication date Aug 17, 2023
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID MOLDING COMPOUND FOR PROTECTING FIVE EDGES OF SEMICONDUCTOR...
- Publication number 20230094916
- Publication date Mar 30, 2023
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...