Sheou Hooi Lim

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Die molding for flip chip molded matrix array package using UV cura...
- Patent number 7,465,368
- Issue date Dec 16, 2008
- Intel Corporation
- Szu Shing Lim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
DIE MOLDING FOR FLIP CHIP MOLDED MATRIX ARRAY PACKAGE USING UV CURA...
- Publication number 20090025882
- Publication date Jan 29, 2009
- Intel Corporation
- Szu Shing Lim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL