Shi Chai Chong

Follow

Person

Penang, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Die stack override for die testing
- Patent number 11,476,168
- Issue date Oct 18, 2022
- Intel Corporation
- Terrence Huat Hin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation for electroluminescent devices
- Patent number 7,423,375
- Issue date Sep 9, 2008
- Osram GmbH
- Ewald Guenther
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform deposition of organic layer
- Patent number 7,148,624
- Issue date Dec 12, 2006
- Osram Opto Semiconductors (Malaysia) Sdn. Bhd
- Ewald Guenther
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE STACK OVERRIDE FOR DIE TESTING
- Publication number 20190311960
- Publication date Oct 10, 2019
- Intel Corporation
- Terrence Huat Hin Tan
- G01 - MEASURING TESTING
Information Patent Application
UNIFORM DEPOSITION OF ORGANIC LAYER
- Publication number 20030214232
- Publication date Nov 20, 2003
- Ewald Guenther
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation for electroluminescent devices
- Publication number 20030209979
- Publication date Nov 13, 2003
- Osram Opto Semiconductors GmbH
- Ewald Guenther
- H01 - BASIC ELECTRIC ELEMENTS