Shi GANG

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Asymmetrical I/O structure
- Patent number 11,855,631
- Issue date Dec 26, 2023
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package substrate manufacturing method
- Patent number 11,825,607
- Issue date Nov 21, 2023
- Montage Technology (Kunshan) Co., Ltd.
- Meng Mei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular intelligent combined wind power converter and control metho...
- Patent number 11,677,334
- Issue date Jun 13, 2023
- Shanghai Jiao Tong University
- Xu Cai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Solid-state transformer having uninterrupted operation ability unde...
- Patent number 11,431,263
- Issue date Aug 30, 2022
- Shanghai Jiao Tong University
- Jianwen Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for testing electrical performance of packaged chip
- Patent number 11,393,732
- Issue date Jul 19, 2022
- MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
- Meng Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate structure and test method for detecting inter-metal dielec...
- Patent number 11,270,918
- Issue date Mar 8, 2022
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular multilevel converter with multi-port DC power flow control...
- Patent number 11,133,752
- Issue date Sep 28, 2021
- Shanghai Jiao Tong University
- Jianwen Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
ICP source design for plasma uniformity and efficiency enhancement
- Patent number 9,431,216
- Issue date Aug 30, 2016
- ADVANCED MICRO-FABRICATION EQUIPMENT INC, SHANGHAI
- Songlin Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ICP source design for plasma uniformity and efficiency enhancement
- Patent number 9,095,038
- Issue date Jul 28, 2015
- Advanced Micro-Fabrication Equipment, Inc. Asia
- Shi Gang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-PORT AC POWER GRID FLEXIBLE INTERCONNECTION DEVICE AND CONTRO...
- Publication number 20230396065
- Publication date Dec 7, 2023
- SHANGHAI JIAOTONG UNIVERSITY
- Jianwen ZHANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220301888
- Publication date Sep 22, 2022
- MONTAGE TECHNOLOGY CO., LTD.
- Meng MEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR INTELLIGENT COMBINED WIND POWER CONVERTER AND CONTROL METHO...
- Publication number 20220271685
- Publication date Aug 25, 2022
- SHANGHAI JIAO TONG UNIVERSITY
- Xu CAI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SOLID-STATE TRANSFORMER HAVING UNINTERRUPTED OPERATION ABILITY UNDE...
- Publication number 20220166343
- Publication date May 26, 2022
- SHANGHAI JIAO TONG UNIVERSITY
- Jianwen ZHANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD FOR TESTING ELECTRICAL PERFORMANCE OF PACKAGED CHIP
- Publication number 20220148932
- Publication date May 12, 2022
- MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
- Meng MEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20220141962
- Publication date May 5, 2022
- MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
- Meng MEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRICAL I/O STRUCTURE
- Publication number 20220060187
- Publication date Feb 24, 2022
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong ZHANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MODULAR MULTILEVEL CONVERTER WITH MULTI-PORT DC POWER FLOW CONTROL...
- Publication number 20210203247
- Publication date Jul 1, 2021
- SHANGHAI JIAO TONG UNIVERSITY
- Jianwen ZHANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LAMINATE STRUCTURE AND TEST METHOD FOR DETECTING INTER-METAL DIELEC...
- Publication number 20190371685
- Publication date Dec 5, 2019
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ICP SOURCE DESIGN FOR PLASMA UNIFORMITY AND EFFICIENCY ENHANCEMENT
- Publication number 20160322205
- Publication date Nov 3, 2016
- ADVANCED MICRO-FABRICATION EQUIPMENT INC, SHANGHAI
- Songlin XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ICP SOURCE DESIGN FOR PLASMA UNIFORMITY AND EFFICIENCY ENHANCEMENT
- Publication number 20140120731
- Publication date May 1, 2014
- ADVANCED MICRO-FABRICATION EQUIPMENT INC, SHANGHAI
- Songlin XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ICP SOURCE DESIGN FOR PLASMA UNIFORMITY AND EFFICIENCY ENHANCEMENT
- Publication number 20130102155
- Publication date Apr 25, 2013
- Shi GANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Asymmetrical I/O structure

Package substrate manufacturing method

Modular intelligent combined wind power converter and control metho...

Solid-state transformer having uninterrupted operation ability unde...

Method for testing electrical performance of packaged chip

Laminate structure and test method for detecting inter-metal dielec...

Modular multilevel converter with multi-port DC power flow control...

ICP source design for plasma uniformity and efficiency enhancement

ICP source design for plasma uniformity and efficiency enhancement

Patents Applicationslast 30 patents

MULTI-PORT AC POWER GRID FLEXIBLE INTERCONNECTION DEVICE AND CONTRO...

PACKAGE SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SAME

MODULAR INTELLIGENT COMBINED WIND POWER CONVERTER AND CONTROL METHO...

SOLID-STATE TRANSFORMER HAVING UNINTERRUPTED OPERATION ABILITY UNDE...

METHOD FOR TESTING ELECTRICAL PERFORMANCE OF PACKAGED CHIP

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

ASYMMETRICAL I/O STRUCTURE

MODULAR MULTILEVEL CONVERTER WITH MULTI-PORT DC POWER FLOW CONTROL...

LAMINATE STRUCTURE AND TEST METHOD FOR DETECTING INTER-METAL DIELEC...

ICP SOURCE DESIGN FOR PLASMA UNIFORMITY AND EFFICIENCY ENHANCEMENT

ICP SOURCE DESIGN FOR PLASMA UNIFORMITY AND EFFICIENCY ENHANCEMENT

ICP SOURCE DESIGN FOR PLASMA UNIFORMITY AND EFFICIENCY ENHANCEMENT