Shi-ning Yang

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Guard wall to reduce delamination effects within a semiconductor die
- Patent number 5,986,315
- Issue date Nov 16, 1999
- Intel Corporation
- Melton C. Bost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via hole profile and method of fabrication
- Patent number 5,874,358
- Issue date Feb 23, 1999
- Intel Corporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchored via connection
- Patent number 5,619,071
- Issue date Apr 8, 1997
- Intel Corporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via hole profile and method of fabrication
- Patent number 5,470,790
- Issue date Nov 28, 1995
- Intel Corporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a guard wall to reduce delamination effects
- Patent number 5,270,256
- Issue date Dec 14, 1993
- Intel Corporation
- Melton C. Bost
- H01 - BASIC ELECTRIC ELEMENTS